Motorola Corporation

Minoo D Press

Kevin J McDunn

Linda Limper-Brenner

Debabrata Pal

Detlef W Schmidt

Martinho Rabindra Pais

Markus Dantinne

An air moving device in the form of an axial flow fan is provided that is adapted for use in substantially enclosed high-density electrical systems, e.g. computers and the like. The fan includes an annular wall extending about the blades thereof and in which pressure equalizing openings are formed for increasing the maximum pressure in the preferred operating area of the fan and just before the stall effect occurs due to increasing system pressure resistance. A method is also provided for optimizing the number and size of the slots to obtain a desired maximum pressure increase. The slots are optimized so that there is no appreciable airflow loss in early stages of the preferred operating area while providing the desired increase in maximum pressure. The slots preferably have an elongated shape, e.g. rectangular or oval, with a major dimension extending generally axially and parallel to the axis of rotation of the blades, and are spaced from each other circumferentially about the annular wall.

Air moving apparatus and method of optimizing performance thereof

The present invention provides a fan (100) that includes a hub (102) and a plurality of blades (104). The hub (102) has a blade attachment surface (106) that extends around the circumference of the hub (102). The blades (104) extend from the blade attachment surface (106). Each of the blades (104) has a blade tip (108) distal from the blade attachment surface (106) and a chord length (110) defined as the width of the blade (104). Each blade (104) includes a hub chord length (112) defined as the chord length of the blade (104) at the blade attachment surface (106) and a tip chord length defined as the chord length at the blade tip (108). The relationship of the chord length to the blade radius is defined as the area bounded by the following equations:

Low-noise, high-performance fan

According to an aspect of the present invention, the foregoing needs are addressed by a splicing tool for joining a first tube and a second tube, including a first member and a second member which are moveably coupled. The first member has a first handle section and a first mold section. The first mold section has a first groove. The second member has a second handle section and a second mold section. The second mold section has a second groove. The first groove sized to receive at least a portion of a first tube, at least a portion of a second tube and a bonding material. The bonding material attaches the first tube to the second tube when the first and second grooves are substantially aligned and heat is applied to the bonding material.

Splicing tool and method for joining a first tube and a second tube

The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension region has a surface that is substantially coplanar with the second side (82). There is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82).

Process for mounting an electronic component to a substrate and process

The apparatus includes a substantially planar plate having a first side and a second side. A plurality of substantially planar fluid distributing manifolds are formed in the first side of the plate, each fluid distributing manifold having a surface recessed relative to at least a portion of the first side of the plate. A nozzle housing is located in the surface of each fluid distributing manifold. The nozzle housing is adapted to receive a nozzle and has a receptacle end and a spray end. The spray end has an aperture, and is in communication with the second side of the plate. The receptacle end is in communication with the surface of one of the plurality of fluid distributing manifolds.

Apparatus for spray-cooling multiple electronic modules

The peristaltic pump includes a motor and an assembly driven by the motor. The assembly includes a rotating member, a retaining member having a slot, and a tubing advance pad sized to be substantially disposed in the slot, wherein in a first time interval the tubing advance pad is substantially disposed in the slot and the rotating member is configured to compress a tube along a path defined by the retaining member and at least a portion of the tubing advance pad, and in a second time interval the retaining member is configured to release the tubing advance pad from the slot, the tubing advance pad is coupled to the rotating member and the tube is prepared to advance from a first position to a second position.

Peristaltic pump and method in a peristaltic pump for advancing a tube

Apparatus and method for mounting an electronic component to a substrate

The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). A first fluid distributing conduit (28) is disposed in the first layer (12) and a second fluid distributing conduit (28) is disposed in the second layer (14). A first nozzle housing (30) having a first aperture (36) is disposed in the first fluid distributing conduit (28) and a second nozzle housing (30) having a second aperture (36) is disposed in the second fluid distributing conduit (28).

Apparatus and method for spray-cooling an electronic module

The apparatus includes a cover (10) having a first surface (12) and a second surface (14) opposed to the first surface (12). The second surface (14) has an edge (16) defining a perimeter and has a recessed region (18). A wall (20) is in communication with the recessed region (18), the wall (20) and at least a portion of the edge (16) define a compartment (22). An electromagnetic interference-attenuating material (24) is disposed in the compartment (22), and a fluid distributing manifold (26) is disposed in the cover (10). A nozzle housing (30) sized to receive a nozzle is located in the fluid distributing manifold (26). The nozzle housing (30) has a receptacle end (32) and a spray end (34). The spray end (34) has an aperture (36) in communication with the compartment (22) and the receptacle end (32) is in communication with the fluid distributing manifold (26).

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Minoo D Press