Stats Chippac Pte. Ltd.

Samsung Electronics Co., Ltd.

MinKyung Kang

KyoungHee Park

Dong Ju Jeon

YoungDal Roh

Seohee Park

Yongsuk Tak

Provided is a method of manufacturing a semiconductor device, the method including: forming a mold structure comprising insulation layers and sacrificial layers alternately and repeatedly stacked on a substrate; forming a channel hole extending through the mold structure; forming a blocking layer in the channel hole; forming a charge storage layer on the blocking layer; forming a tunnel insulation layer including a doping element on the charge storage layer; performing heat treatment to diffuse the doping element from the tunnel insulation layer to the charge storage layer; and forming a channel layer on the tunnel insulation layer.

Method of manufacturing semiconductor device comprising doping element in the charge storage layer

An integrated circuit packaging system and method of manufacture thereof includes: a dielectric core having an embedded pad; a top solder resist layer on the dielectric core, a pad top surface of the embedded pad below the top solder resist layer; a device interconnect attached to the embedded pad; and an integrated circuit device having an interconnect pillar, the interconnect pillar attached to the device interconnect for mounting the integrated circuit device to the dielectric core.

Integrated circuit packaging system with embedded pad on layered substrate and method of manufacture thereof

Growing community of inventors

Seoul, South Korea

MinKyung Kang