Samsung Electronics Co., Ltd.

Minki Kim

Chulwoo Park

Jinbong Ryu

Donghyun Yeom

Sanghun Lee

Dongil Son

Seungduk Baek

Yongjae Song

Sungtae Park

Woosung Jang

Min Cheol Park

Jihoon Kim

Hyunsoo Kim

Jungmin Park

Chihyun Cho

Hyungsuk Kim

Sang-Uk Han

Jae-Min Jung

Jeong-Kyu Ha

Hyuekjae Lee

Hyunkyoung Kim

Wonil Lee

Jimin Kim

Seungbum Lee

Gwangjae Jeon

Byunghoon Lee

Bongkyu Kim

Hyelim Yun

Hyemin Kim

Soojeoung Park

Won Il Lee

Hyuntaek Lee

Seungseok Hong

Byungsung Kang

Duckgyu Kim

Jihwa Park

Hongjin Park

Jongmoon Park

Kicheol Bae

Kwangmin Byeon

Kwanguk Kim

Hwanyeol Kim

Junui Seo

Hongshin Shin

Hyungjun Ahn

Disclosed are semiconductor devices and their fabrication methods. The semiconductor device comprises lower and upper structures. The lower structure includes a first semiconductor substrate, a first pad, and a first dielectric layer. The upper structure includes a second semiconductor substrate, a second pad, and a second dielectric layer. The upper and lower structures are bonded to each other to allow the first and second pads to come into contact each other and to allow the first and second dielectric layers to come into contact each other. A first interface between the first and second pads is at a level different from that of a second interface between the first and second dielectric layers. A first area of the first pad is greater than a second area of the second pad. A second thickness of the second pad is different from a first thickness of the first pad.

Semiconductor device and method of fabricating the same

A semiconductor package is provided in which a first insulating layer includes a first recess spaced apart from a first pad in a first direction, and a second insulating layer includes a second recess spaced apart from a second pad in the first direction and overlapping at least a portion of the first recess in a second direction, perpendicular to the first direction, to provide an air gap together with the first recess. The semiconductor package further includes a first bonding surface defined by the first and second insulating layers contacting each other on one side of the air gap, adjacent to the first and second pads, and a second bonding surface defined by the first and second insulating layers contacting each other on another side of the air gap, opposite to the one side.

Semiconductor package, and method of manufacturing the same

A semiconductor package includes a first semiconductor chip including a first semiconductor layer, a first through-electrode that penetrates through the first semiconductor layer, a first bonding pad connected to the first through-electrode, and a first insulating bonding layer, and a second semiconductor chip on the first semiconductor chip and including a second semiconductor layer, a second bonding pad bonded to the first bonding pad, and a second insulating bonding layer bonded to the first insulating bonding layer, wherein the first insulating bonding layer includes a first insulating material, the second insulating bonding layer includes a first insulating layer that forms a bonding interface with the first insulating bonding layer and a second insulating layer on the first insulating layer, the first insulating layer includes a second insulating material, different from the first insulating material, and the second insulating layer includes a third insulating material, different from the second insulating material.

Semiconductor package with bonding interface

A semiconductor package includes: a semiconductor substrate; a through electrode that penetrates the semiconductor substrate; a first pad disposed on the through electrode; and a dielectric structure disposed on the semiconductor substrate, wherein a lower portion of the dielectric structure at least partially surrounds the through electrode, wherein an upper portion of the dielectric structure at least partially surrounds the first pad, wherein the dielectric structure includes: a first dielectric pattern; an etch stop pattern disposed on the first dielectric pattern; and a second dielectric pattern spaced apart from the first dielectric pattern by the etch stop pattern, wherein the first pad is in contact with the through electrode, the first dielectric pattern, the etch stop pattern, and second dielectric pattern, and wherein a top surface of the through electrode is at a level higher than a level of a top surface of the first dielectric pattern.

Semiconductor package

An antenna device and an electronic device including the same are provided. The antenna device includes a housing that includes a first plate, a second plate facing a direction opposite to the first plate, and a side member surrounding a space between the first plate and the second plate, a display viewable through at least a portion of the first plate, an antenna assembly disposed within the housing wherein the antenna assembly includes a first printed circuit board, a second printed circuit board, at least one structure interconnecting the first printed circuit board and the second printed circuit board and including conductive paths, a plurality of conductive patterns, and a wireless communication circuit, a flexible printed circuit board, and a third printed circuit board.

Antenna device and electronic device including the same

An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.

Electronic device including antenna member for wireless charging

Various embodiments of the present disclosure provide an electronic device comprising: a communication module comprising communication circuitry, a memory, and a processor operatively connected to the communication module and the memory, wherein the processor is configured to: control the electronic device to establish a connection to a wearable display device through the communication module, receive gaze information from the wearable display device, determine a first application and a second application corresponding to the gaze information to be displayed on a screen, identify profiles of the determined first application and second application, and combine graphic data corresponding to the first application and graphic data corresponding to the second application and transmit the combined graphic data to the wearable display device, or transmit each of graphic data corresponding to the first application and graphic data corresponding to the second application to the wearable display device, based on the identified profiles.

Device and method for transmitting data of multiple applications with low latency

Disclosed is a semiconductor package comprising a semiconductor chip, a first chip pad on a bottom surface of the semiconductor chip and adjacent to a first lateral surface in a first direction of the semiconductor chip, the first lateral surface separated from the first chip pad from a plan view in a first direction, and a first lead frame coupled to the first chip pad. The first lead frame includes a first segment on a bottom surface of the first chip pad and extending from the first chip pad in a second direction opposite to the first direction and away from the first lateral surface of the semiconductor chip, and a second segment which connects to a first end of the first segment and then extends along the first direction to extend beyond the first lateral surface of the semiconductor chip after passing one side of the first chip pad, when viewed in the plan view.

An electronic device is provided. The electronic device includes communication circuitry configured to communicate with an external electronic device, a processor operatively connected with the communication circuitry, and a memory operatively connected with the processor. The memory may store instructions which, when executed, cause the processor to control the electronic device to: obtain environment information associated with a video playback environment of the external electronic device, decode a high dynamic range (HDR) video, perform color conversion of the decoded HDR video based on the environment information, encode the color-converted video into a standard dynamic range (SDR) format, and transmit the encoded video to the external electronic device via the communication circuitry.

Electronic device for playing high dynamic range video and method thereof

An electronic device including at least one memory; a first display; a communication circuit; and at least one processor. The at least one processor is configured to while displaying multimedia content on the first display, receive capability data of an external electronic device for indicating that change of a posture of a second display of the external electronic device is available. The at least one processor is also configured to determine a posture of the second display corresponding to a display direction of the multimedia content. The at least one processor is further configured to transmit posture control information for indicating the determined posture to the external electronic device. Additionally, the at least one processor is configured to transmit streaming data of the multimedia content displayed on the first display to the external electronic device in order to display the multimedia content on the second display.

Electronic device, method, and computer readable medium for providing screen sharing service through external electronic device

An electronic device includes a housing; a first circuit board, and a flexible circuit board. The first circuit board is disposed in an internal space of the housing and includes a plurality of first conductive terminals. The flexible circuit board includes a first connection portion including a plurality of second conductive terminals configured to connect to the plurality of first conductive terminals. The flexible circuit board also includes a connection portion extended from the first connection portion, and at least one conductive layer extended from the connection portion to at least a portion of the first connection portion. Additionally, the flexible circuit board includes at least one transmissive area in which light may be transmitted and the at least one conductive layer is at least partially omitted. At least some of the plurality of second conductive terminals are visible from the outside through the at least one transmissive area.

Electronic device including flexible printed circuit board

An electronic device is disclosed. An electronic device comprises a display, a communication circuit configured to communicate with a first peripheral device, a memory configured to store first authentication information associated with the first peripheral device, and a processor, wherein the processor is configured to control the electronic device to: broadcast a first message via the communication circuit, receive a connection request message from the first peripheral device receiving the first message, authenticate the first peripheral device based on the first authentication information associated with the first peripheral device in response to the reception of the connection request message, and transmit screen data being displayed on the display to the first peripheral device via the communication circuit based on the authentication being valid.

Electronic device and method for sharing screen data

Growing community of inventors

Suwon-si, South Korea

Minki Kim