Samsung Electronics Co., Ltd.

Lg Chem, Ltd

Lg Electronics Inc.

Kolon Life Science, Inc.

Hyundai Motor Company

Lg Magna E-powertrain Co., Ltd.

Seoul National University

Sungkyunkwan University

Industry-University Cooperation Foundation Hanyang University

Dongwoo Fine-chem Co., Ltd.

Kia Motor Corporation

Youngshin Precision Co., Ltd.

Minjung Kim

Dongkyu Kim

Mooyoung Kim

Seokhyun Lee

Dal Mo Kang

BumHyun Lee

Jong Moon Yoon

Jin Kyu Lee

Doosuk Kang

Jongyoun Kim

Buseop Jung

JungSik Kim

Kyoung Lim Suk

Bokun Choi

Jungeun Lee

Hyejeong Kim

Sunghyun Kim

Jaeyoung Huh

Jaegwon Jang

Min Soo Kim

Jihwan Kim

Sangho Lee

Doyoung Lee

Sanghyun Lee

Jung Hun Lee

Woo Young Lee

Jaemin Lee

Seungju Han

Hyuk Kang

Dongwook Kim

Jaebong Chun

Hyunjoon Kim

Suha Yoon

Youngjin Park

Jongin Lee

Daeyun Park

Kiwon Kim

Younghyun Kim

Seon Min Rhee

Han Soo Kim

Jookwan Lee

Hyesun Lee

Seungmin Baek

Jin-Kyu Shin

Kyunghwan Kim

DalMo Kang

Hyeonjeong Hwang

Hee Soo Yoon

Sujeong Kim

Jinkyu Lee

Young-Gyun Kim

Wookwang Lee

Minju Kim

Sungjun Lee

Chae Ho Chung

Gyuho Eoh

Junsuk Kim

Hyunah Oh

Keung Beum Kim

Hyoungrock Kim

Sangwon Chae

Hyejung Bang

Taewon Yoo

Sangyoon Jeong

Namju Cho

Daewook Kim

Seungjin Kim

Jinhee Lee

Hyosan Lee

Byoung Kuk Lee

Junhee Yeo

Wonsuk Chung

Gyu Yeong Choe

Sang-kyun Im

Dongho Jang

Jinyung Park

Joonsung Kim

Yongju Lee

Hakryoul Kim

Kamin Lee

Suyeon Kim

Jongsu Kim

Daehyun Cho

Kiho Lee

Yeonho Jang

Soonho Lee

Jungmin Oh

Yeonsoo Kim

Kwanhee Jeong

Jin-Gil Yang

Jinho Son

Hyojong Kim

Woojoong Lee

Youngkyoo Kim

Byeong Seob Song

Gunhee Kim

Taehee Kwak

Woojun Choi

JunSeok Choi

Dong Ki Noh

An electronic device according to various embodiments of the present disclosure may comprise: a display which can be expanded or reduced; at least one sensor; and a processor, wherein the processor is configured to: identify whether an input is received; based on identifying that an input has been received, identify whether the display is expanded or reduced within a given period of time, using the at least one sensor; and based on identifying that expansion or reduction of the display is started within the given period of time, execute a specified function corresponding to the identified input.

Electronic device including expandable display and operation method thereof

An electronic device includes: at least one microphone; a main processing circuit; and an audio processing circuit, wherein the main processing circuit is configured to: obtain, via the at least one microphone, first audio data including a first number of audio channels, the first number being greater than or equal to one; receive second audio data including a second number of audio channels from an external device connected to the electronic device, the second number being greater than or equal to one; and provide the first audio data and the second audio data to the audio processing circuit, and wherein the audio processing circuit is configured to: produce a single audio stream including a third number of audio channels by using the first number of audio channels of the first audio data and the second number of audio channels of the second audio data; and provide the single audio stream to the main processing circuit.

Method and device for processing audio data obtained via microphone and audio data received via external device into single audio stream

An electronic device for performing hash authentication on a neural network, and an operating method therefor are disclosed. The disclosed electronic device comprises: a processor and a memory having at least one instruction executable by the processor. If at least one instruction is executed by the processor, the processor can be configured to: generate a hash value on the basis of parameters of a neural network used for an application to be executed, determine whether the generated hash value matches the pre-stored reference hash value in the security area of the processor, and approve the loading of the neural network in response to whether the generated hash value matches the reference hash value in the general area of the processor.

Electronic device for performing hash authentication on neural network, and operating method therefor

A semiconductor package includes: a package substrate; a first semiconductor chip disposed on the package substrate; a heat-dissipation pattern disposed on the first semiconductor chip; a first mold layer disposed on the package substrate and at least partially surrounding the first semiconductor chip and the heat-dissipation pattern; a redistribution layer disposed on the first mold layer; a penetration electrode penetrating the first mold layer and coupled to the package substrate; and a connection pattern disposed on the penetration electrode, and connecting the redistribution layer to the penetration electrode, wherein a top surface of the heat-dissipation pattern and a top surface of the connection pattern are exposed by the first mold layer.

Semiconductor package and method of fabricating the same

An electronic device of the present invention comprises: an exterior housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a display of which at least a part is exposed through the first surface; and a polymer plate which forms at least a part of the second surface of the housing. The polymer plate comprises: at least one opaque layer; at least one polymer layer that is translucent or transparent and is disposed on the at least one opaque layer; and a coating layer that is disposed on the at least one polymer layer and has a hardness greater than or equal to a selected hardness. Each of the at least one opaque layer, the at least one polymer layer, and the coating layer may comprise a first surface, and a second surface extending from the first surface so that at least a part thereof is bent. Other embodiments are also possible.

Method for manufacturing exterior housing and electronic device comprising same

An electronic device is provided. The electronic device includes a storage, a volatile memory, and a processor, wherein the processor is configured to identify temperature information based on a temperature of the volatile memory and a temperature of the processor, to identify a first temperature section corresponding to the temperature information among a plurality of predetermined temperature sections, to perform calibration of the volatile memory to acquire an operation parameter corresponding to the first temperature section, and to adjust a timing between signals for controlling an operation of the volatile memory based on the operation parameter.

Electronic device controlling an operation of a volatile memory and method for operating the same

A semiconductor package includes a redistribution substrate including a first surface and a second surface that are opposite to each other, an antenna substrate on the first surface and including a first insulating portion and antenna patterns on a top surface of the first insulating portion, and a first semiconductor chip on the second surface. The redistribution substrate includes a second insulating portion, and a redistribution pattern in the second insulating portion. The redistribution pattern includes an interconnection portion extending parallel to a top surface of the second insulating portion, and a via portion protruding from the interconnection portion toward the first surface. A width of the via portion decreases as a height in a direction from the second surface toward the first surface increases. The active surface of the first semiconductor chip is adjacent to the second surface.

Semiconductor package

Disclosed is an electronic device may include a memory storing a neural network including a plurality of layers, each of the plurality of layers comprising a plurality of kernels, and at least one processor, wherein the at least one processor is configured to: arrange the neural network; and perform neural network processing on input data based on the arranged neural network, and wherein the arranging the neural network includes: with respect to each of the plurality of layers of the neural network, identifying a number of first weights of each of a plurality of kernels included in a layer; identifying a turn that each of the plurality of kernels included in the layer has in an operation sequence based on the identified number of first weights; and updating the turn that each of the plurality of kernels has in the operation sequence based on the identified turn for each of the plurality of kernels.

Electronic device for rearranging kernels of neural network and operating method thereof

A semiconductor package includes a substrate; and a first semiconductor device and a second semiconductor device that are provided on the substrate. The substrate includes a first dielectric layer and a second dielectric layer provided on the first dielectric layer, a plurality of signal lines provided between the first dielectric layer and the second dielectric layer and connecting the first semiconductor device to the second semiconductor device, and a conductive pad and a conductive plate provided on the second dielectric layer. The conductive pad overlaps the first semiconductor device or the second semiconductor device. The conductive plate overlaps the signal lines.

Semiconductor package including outer conductive plate

A semiconductor package includes a first redistribution substrate, a lower semiconductor chip on the first redistribution substrate and a through via therein, a first lower conductive structure and a second lower conductive structure that are on the first redistribution substrate and are laterally spaced apart from the lower semiconductor chip, an upper semiconductor chip on the lower semiconductor chip and the second lower conductive structure and coupled to the through via and the second lower conductive structure, and an upper conductive structure on the first lower conductive structure. A width of the second lower conductive structure is greater than a width of the through via.

An electronic device may include: a housing including a first housing and a second housing movable with respect to the first housing; a flexible display in which a display area for displaying a screen is expanded or reduced as the second housing moves with respect to the first housing; a memory; and a processor, wherein the processor is configured to: identify a change in the size of the display area on the basis of the movement of the second housing relative to the first housing; determine an application to be preloaded from among a plurality of applications on the basis of the identified size of the display area; load, into the memory, a preload process including some of resources for executing the determined application to be preloaded; and, in response to the occurrence of an event associated with the execution of the application to be preloaded, load an activity for the execution of the application by using the loaded preload process.

Method for preloading application and electronic device supporting same

A semiconductor package including a redistribution substrate extending in a first direction and a second direction perpendicular to the first direction, a semiconductor chip mounted on a top surface of the redistribution substrate, and an outer terminal on a bottom surface of the redistribution substrate. The redistribution substrate may include an under-bump pattern, a redistribution insulating layer covering a top surface and a side surface of the under-bump pattern, a protection pattern interposed between the top surface of the under-bump pattern and the redistribution insulating layer, and interposed between the side surface of the under-bump pattern and the redistribution insulating layer, and a redistribution pattern on the under-bump pattern. The outer terminal may be disposed on a bottom surface of the under-bump pattern.

A semiconductor package includes a redistribution substrate and a semiconductor chip thereon. The redistribution substrate includes a ground under-bump pattern, signal under-bump patterns laterally spaced apart from the ground under-bump pattern, first signal line patterns disposed on the signal under-bump patterns and coupled to corresponding signal under-bump patterns, and a first ground pattern coupled to the ground under-bump pattern and laterally spaced apart from the first signal line pattern. Each of the signal and ground under-bump patterns includes a first part and a second part formed on the first part and that is wider than the first part. The second part of the ground under-bump pattern is wider than the second part of the signal under-bump pattern. The ground under-bump pattern vertically overlaps the first signal line patterns. The first ground pattern does not vertically overlap the signal under-bump patterns.

A semiconductor package includes a redistribution substrate having first and second surfaces opposing one another, a first semiconductor chip on the first surface of the redistribution substrate, a passive device and a metal post on the second surface of the redistribution substrate and electrically connected to the redistribution pattern, a second encapsulant encapsulating at least side surfaces of the passive device and the metal post, a second insulating layer on a lower surface of the metal post and a lower surface of the second encapsulant, and having an opening exposing at least a portion of the lower surface of the metal post, and a connection bump filling the opening of the second insulating layer and in direct contact with the lower surface of the exposed metal post, wherein the metal post has a height greater than a height of each of the redistribution pattern and the redistribution via.

A semiconductor package including: a first substrate and a semiconductor device on the first substrate, wherein the first substrate includes: a first dielectric layer including a first hole; a second dielectric layer on the first dielectric layer and including a second hole that overlaps the first hole, the second hole being wider than the first hole; an under bump disposed in the first hole and the second hole, the under bump covering a portion of the second dielectric layer; and a connection member bonded to the under bump.

Semiconductor package including a dummy pattern

Growing community of inventors

Suwon-si, South Korea

Minjung Kim