Samsung Electronics Co., Ltd.

Minjeong Gu

Jaehoon Choi

Joonsung Kim

Eunseok Cho

A semiconductor package includes a base substrate including a wiring pattern, an interposer substrate including lower and upper redistribution patterns, a semiconductor structure, a heat dissipation structure, a plurality of external connection bumps disposed on a lower surface of the base substrate, a plurality of lower connection bumps disposed between the base substrate and the interposer substrate, and a plurality of upper connection bumps disposed between the interposer substrate and the semiconductor structure.

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Asan-si, South Korea

Minjeong Gu