Samsung Electronics Co., Ltd.

Samsung Display Co., Ltd.

Minill Kim

Jonggi Lee

Kwang Yong Lee

Ji-Seok Hong

Taegyeong Chung

Youngil Kim

Hyun Jeong Woo

JiHoon Mok

Tackkeun Lee

Sangmyung Byun

An apparatus for blanking a printed circuit film from a base film, including: an insert member on a lower plate, overlapping a hit region of the base film and including a first pin hole aligned with an auxiliary fixing-hole of the base film an upper plate overlapping the lower plate and movable relative to the lower plate; a puncher protruding from the upper plate and contacting the hit region of the base film; and a fixing-pin protruding from the upper plate and inserted in the auxiliary fixing-hole of the base film and into the first pin hole of the insert member. The base film includes a reference fixing-hole being collinear with a center line of the printed circuit film, and a a plurality of auxiliary fixing-holes separated from the reference fixing-holes at equal intervals along a longitudinal direction of the base film.

Apparatus for blanking a printed circuit film

A reflow method of a solder ball provided to a treatment object may include providing a coil, applying a current to the coil, and moving the treatment object through an internal space surrounded by the coil.

Reflow method

An apparatus to package a semiconductor chip includes a coil configured to use induction heating to reflow a solder ball of the semiconductor chip. The coil includes a first body, a second body parallel to the first body, a third body extending from the first body to the second body. The first and second bodies are symmetrical with respect to a vertical plane disposed therebetween. The first and second bodies have inclined surfaces facing each other, and the inclined surfaces are distant from each other downward.

Coil and semiconductor apparatus having the same

Provided is an apparatus for performing a reflow process of a solder ball provided to a semiconductor chip. The reflow apparatus may include a coil, a support member and a moving member. The coil may receive a current from a power supply to heat the solder ball using an induced heating method. The support member may be disposed on the front or the rear of the coil and may support a printed circuit board on which a semiconductor chip is mounted. The moving member may move the printed circuit board so that the printed circuit object passes through an internal space surrounded by the coil.

Reflow apparatus, reflow method, and package apparatus

An assembling apparatus includes a chip transfer unit, a heating unit, a testing unit, and an output unit. The chip transfer unit mounts first semiconductor chip to a circuit board to form an electrical circuit. The heating unit heats a solder connection to electrically connect the semiconductor chip to the circuit board. The testing unit tests the semiconductor chip, and, when the testing unit determines that the first semiconductor chip is not functioning properly, the heating unit reheats the solder connection to remove the non-functioning semiconductor chip from the circuit board.

Growing community of inventors

Cheonan-si, South Korea

Minill Kim