Samsung Electronics Co., Ltd.

Minho Lee

Youngjae Kim

Jaewook Yoo

Jaekwang Lee

Youngwoong Kim

Yeonsoo Kim

An electronic device may include: a display having at least one hole disposed in at least a part thereof such that light from the outside can be transmitted therethrough; a light-emitting element disposed under the display and configured to output a first infrared ray to the outside; a first light-receiving element disposed under the display at a position corresponding to the at least one hole, and configured to receive a second infrared ray transmitted from the outside; a second light-receiving element disposed under the display at a position where light from the outside is shielded; and at least one processor configured to, based on that a first sensing value according to the second infrared ray, output from the first light-receiving element, satisfies a first specified condition, while the first infrared ray is output: based on that a second sensing value output from the second light-receiving element does not satisfy a second specified condition, identify that a proximate object exists, and based on that the second sensing value satisfies the second specified condition, identify that the proximate object does not exist.

Electronic device including proximity sensor having a plurality of light receiving elements and method of controlling the same

Provided are package-on-package (POP)-type semiconductor packages including a lower package having a first size and including a lower package substrate in which a lower semiconductor chip is, an upper redistribution structure on the lower package substrate and the lower semiconductor chip, and alignment marks. The packages may also include an upper package having a second size smaller than the first size and including an upper package substrate and an upper semiconductor chip. The upper package substrate may be mounted on the upper redistribution structure of the lower package and electrically connected to the lower package, and the upper semiconductor chip may be on the upper package substrate. The alignment marks may be used for identifying the upper package, and the alignment marks may be below and near outer boundaries of the upper package on the lower package.

Package-on-package (POP) type semiconductor packages

A server and a controlling method therefor are provided. The server includes a communicator, a memory, and a processor configured to receive first log information related to a first material generated in a first facility among facilities, the first facility belonging to a first process for manufacturing a product through the communicator, generate an identifier (ID) regarding the first material, generate tracking information on the first material based on the first log information, assign the ID to the tracking information, receive pieces of second log information generated in a second facility among the facilities, the second facility belonging to a second process following the first process through the communicator, identify second log information corresponding to the first material among the pieces of second log information based on the first log information included in the tracking information, and update the tracking information based on the identified second log information.

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Suwon-si, South Korea

Minho Lee