Littelfuse, Inc.

Minh V Ngo

Martin G Pineda

Anthony Vranicar

Dov Nitzan

Kedar V Bhatawadekar

Mario G Sepulveda

Jianhua Chen

Yuriy Borisovich Matus

Robert Daniel Hilty

Arata Tanaka

Weiqing Guo

Sergio Fuentes Godinez

A metal oxide varistor (MOV) device including a MOV chip, electrically conductive first and second electrodes disposed on opposite sides of the MOV chip, and electrically conductive first and second leads connected to the first and second electrodes, respectively, wherein the first and second electrodes are formed of a material having a melting point greater than 1100 degrees Celsius.

Metal oxide varistor with reinforced electrodes

A thermal cut-off device includes a plastic base, two electrodes, a temperature sensing element, and a plastic cover that fits over the base. The temperature sensing element is curved downward, and may be a bimetal or a trimetal. When the device is subject to an over-temperature condition, the orientation of the curve flips such that the temperature sensing element is then curved upward. When the temperature sensing element is curved upward, it lifts an arm of one of the electrodes, which severs the electrical connection between the electrodes. In this manner the device shuts off during an over-temperature condition in order to protect the circuit in which the device is installed. To prevent corrosion of the temperature sensing element, a first moisture insulation layer is applied to the outer surface of the thermal cut-off device. The moisture insulation layer may be an epoxy adhesive or a UV/visible light-cured adhesive or light/heat cured adhesive. In some embodiments, a second moisture insulation layer is formed on the surface of the temperature sensing element.

Insulated thermal cut-off device

A method of manufacturing a surface mount device includes providing at least one core device and at least one lead frame. The core device is attached to the lead frame. The core device and the lead frame are encapsulated within an encapsulant. The encapsulant comprises a liquid epoxy that when cured has an oxygen permeability of less than approximately 0.4 cm3&#xb7;mm/m2&#xb7;atm&#xb7;day.

Method for manufacturing a surface mount device

A method of manufacturing a surface mount device includes forming a plaque from a material, forming a plurality of conductive protrusions on a top surface and a bottom surface of the plaque, and applying a liquid encapsulant over at least a portion of the top surface and at least a portion of the bottom surface of the plaque. The liquid encapsulant is cured and when cured encapsulant has an oxygen permeability of less than about 0.4 cm3&#xb7;mm/m2&#xb7;atm&#xb7;day. The assembly is cut to provide a plurality of components. After cutting, the top surface of each component includes at least one conductive protrusion, the bottom surface of each component includes at least one conductive protrusion, the top surface and the bottom surface of each component include the cured encapsulant, and a core of each component includes the material.

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San Jose, CA, United States of America

Minh V Ngo