Intel Corporation

Minh T D Le

David Shia

Barrett M Faneuf

Kenan Huseyin Arik

Carlos Alvizo Flores

Brendan T Pavelek

Jeffory L Smalley

Ralph V Miele

Sandeep Ahuja

Phil Geng

Casey R Winkel

Aaron P Anderson

Marc Milobinski

Fernando Gonzalez Lenero

Jun Zhang

Damion T Searls

Richard J Dischler

Jin Yang

Eric W Buddrius

Bijoyraj Sahu

Eric Dwight McAfee

Prabhakar Subrahmanyam

Catharina Biber

Ying-Feng Pang

Michael Berktold

Kristin L Weldon

Yi Xia

Victor Polyanko

Yuyang Xia

Lianchang Du

Javier Avalos Garcia

Mark Bianco

Yuehong Fan

Luz Karine Sandoval Granados

Adriana Lopez Iniguez

Eric D Mcafee

Samer Melhem

Jeffrey Ryan Conner

John Raatz

Bergen Anderson

Shengzhen Zhang

Yuan Li

Hemant Desai

An apparatus is described. The apparatus includes a cover to enclose a junction between respective ends of first and second fluidic conduits. The first and second fluidic conduits transport a coolant fluid within an electronic system. The apparatus also includes a leak detection device to be located within a region that is enclosed by the cover when the junction is enclosed by the cover. The leak detection device is to detect a leak of the coolant fluid at the junction when the junction is enclosed by the cover. The first and second fluidic conduits extend outside the cover when the junction is enclosed by the cover. Another apparatus is also described. The other apparatus includes a leak detection device to detect a leak of coolant fluid from a specific component or junction in a liquid cooling system of an electronic system.

Liquid cooling system leak detection improvements

An apparatus is described. The apparatus includes a housing including a base and sidewalls. The housing is to support a circuit board. The apparatus also includes a heat sink to be supported by the housing independent of the circuit board. The heat sink is to be thermally coupled to a semiconductor package attached to the circuit board. The heat sink is to be closer to the base of the housing than the circuit board is to be to the base of the housing.

Electronic systems with inverted circuit board with heat sink to chassis attachment

An apparatus is described. The apparatus includes an electronic system. The electronic system includes a chassis. The electronic system includes a semiconductor chip cooling component that is rigidly fixed to the chassis. The electronic system includes a packaged semiconductor chip having a lid that is contact with the semiconductor chip cooling component. The electronic system includes an electronic circuit board. The packaged semiconductor chip is electro-mechanically attached to the electronic circuit board.

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North Plains, OR, United States of America

Minh T D Le