Hewlett-packard Development Company, L.p.

Hewlett Packard Enterprise Development LP

Compaq Computer Corporation, Inc.

Sandisk Technologies Inc.

Midway Games West Inc.

Minh H Nguyen

Alan B Doerr

David A Selvidge

Qiang Wang

Pinche Tsai

Kelly Kennedy Smith

Robert J Hastings

Paul E Westphall

Earl W Moore

Mark S Tracy

Vincent Hung Nguyen

Keith A Sauer

John E Youens

Chanh V Hua

E David Neufeld

Shou-Jen Yang

Kevin Bold

Curtis L Progl

Kapil Rao Ganta Papa Rao Bala

Donald P Caballero

Stephen N Bushong

Jelle M Schuur

Tahir Cader

Keith J Kuehn

Joseph R Allen

Kevin D Conn

David Paul Mohr

Brian T Purcell

Christian H Post

William C Hallowell

James Jeffery Schulze

Raghavan V Venugopal

Patrick R Cooper

Michael B Raynham

John D Nguyen

Nilashis Dey

Kenny Huy Pham

Myron R Tuttle

Ho M Lai

David Scott Chialastri

Andrew James Phelan

Henry Zhang

Ryuji Yamashita

Michael Stearns

Shigeki Shimomura

Edgar Hance

Jui Lin Chen

Orville H Orr

David M Koonce

Kuan-WeI Chen

Karthigan Srinivasan

Peter W Mokris

John M Lenthall

Martha Gomez, Sr

Andrew Nathan Bulgerin

Michael E Albaugh

A modular rear panel system for a chassis of an electronic device includes modular brackets and modular rear panel sections. The brackets are each configured to be selectively coupled to the chassis at a corresponding one of multiple bracket mounting locations. The rear panel sections are each configured to be selectively coupled to one or more corresponding ones of the modular brackets. The brackets and the plurality of rear panel sections comprise, i.e., can be grouped into, multiple different combinations, with each combination comprising a subset of the rear panel sections and subset of the brackets that can be assembled together to form a rear panel of the chassis, with the subset of brackets coupled to the mounting locations and the subset of rear panel sections coupled to the subset of brackets. The respective rear panels formable by the plurality of combinations have mutually different rear panel configurations.

Modular rear panel system for chassis of electronic device

One aspect of the instant application describes a system that includes a plurality of stacked mezzanine boards communicatively coupled to a motherboard and a metal enclosure enclosing the motherboard and mezzanine boards. A respective mezzanine board can include a number of solder pads, and the metal enclosure can include a plurality of metal strips, a respective metal strip to make contact with a solder pad of a corresponding mezzanine board. The system can further include a logic module positioned on the respective mezzanine board to determine a location of the respective mezzanine board based on a contact pattern between the metal strips and solder pads of the respective mezzanine board.

Intelligent cable topology detection

Blind mate connection techniques and associated connectors are disclosed. Blind mate connectors provide connections where visual inspection at time of connection may not be available. Stacking tolerance increases when connectors have a different set of datums (e.g., a different relative orientation) relative to adjacent connectors. Different datums permit twinning two printed circuit boards ('PCBs') prior to insertion into a slot of a chassis. Each connector may be attached to a respective PCB utilizing a spring and offset feature to provide a standoff on a respective PCB. Control of standoff and rotational movement (e.g., via brackets) allows each individual connector to have a 'float' for improved insertion tolerance. Connector pairs may connect through an opening in a midplane while simultaneously connecting to the midplane. Switch trays and node trays may be inserted through opposing sides of a chassis and be connected through the midplane of that chassis.

Blind mate connections with different sets of datums

An apparatus includes: a 1 U drive chassis divided into a plurality of compartments by a partition, the plurality of compartments including an interior compartment; an interior cage installed in the interior compartment, the interior cage including a plurality of pockets into which storage media are mounted when in use and having a back edge; a hinge by which the interior cage is rotatably mounted to the 1 U drive chassis along the back edge of the interior cage; a lift to rotate the interior cage at least partially to an open position when the first latch is released; and a latch to maintain the interior cage in a closed position and to maintain the interior cage in the opened position according to the rotation of the interior compartment.

Lift and rotating drive cage

A method for performing a read operation of a memory block of a read-only memory array, wherein the method comprises first enabling bit line precharge circuitry of the memory block, (thereby precharging one or more bit lines of the memory block to a first voltage level), enabling a word line of one or more addressed memory cells of the memory block, enabling a leakage current reduction circuit of the memory block, thereby generating across the addressed memory cells a first voltage differential equal to the first voltage level; subsequently discharging the addressed memory cells; disabling the word line of the one or more addressed memory cells; disabling the bit line precharge circuitry; and disabling the leakage current reduction circuit, thereby generating across the one or more addressed memory cells a second voltage differential that is equal to less than the first voltage differential.

Leakage reduction circuit for read-only memory (ROM) structures

Switches and groups of IO ports may be divided into separate switch modules and IO modules that can be connected by high-speed low-loss management cables in a variety of configurations. Thereafter, the separate modules may be replaced independently of each other. The switch module may recognize, and thereafter ignore, unconnected ports, removing the performance penalty that sometimes arises when fewer than all available ports are connected. The switch module may rapidly adjust to addition, subtraction, and replacement of connected IO modules.

Modular, flexibly connected switch-port input-output cards

Embodiments are directed to an assembly including a bay structure including a bay structure that defines a bay for receiving a pluggable module and including sides and a front plate rotatably connected to the sides, a connecting bracket coupled with the bay structure, and a heat transfer device coupled with the bay structure. The bay structure, the heat transfer device, and the connecting bracket are configured such that rotating the front plate from a first position to a second position displaces the connecting bracket in a first direction which causes the connecting bracket to displace the heat transfer device in a second direction transverse to the first direction.

Vertical lift heat transfer device for pluggable modules

The present subject matter relates to screws for tool-less assembling of an electronic board on a chassis. In an example implementation, the screw comprises a threaded pin to secure the screw on the electronic board using a nut. The screw also comprises a screw head that fits into a hook on the chassis when the electronic board is assembled on the chassis. The screw further comprises a flange integral to the screw and positioned between the threaded pin and the screw head. The flange is extended radially to support the electronic board and is positioned at a distance from the screw head based on a gap to be maintained between the electronic board and the chassis.

Tool-less assembling of electronic board on chassis

A device assembly as disclosed herein includes a heat pipe coupled to a heat transfer device, and a thermal interface. The assembly further includes a cold plate rotatably coupled with the heat pipe through a hinge. The thermal interface is coupled with the cold plate through a plane to rotate about the heat pipe together with the cold plate, and the thermal interface includes a material having a thickness and a resiliency configured to make thermal contact with a circuit in a circuit card when the cold plate is rotated over the circuit card. A chassis and a method to build the chassis including the above assembly are also disclosed.

Hinged dimm cooling device

Systems and devices for mounting servers are provided. In one aspect, a rack mounting system includes a first mounting bracket attached to a rack. The rack comprises a rack front side and a rack rear side opposite the rack front side. The first mounting bracket is attached to the rack rear side. A rail bracket is attached to a server component mounted in the rack. A second mounting bracket comprises a first end and a second end. The first end is coupled to the first mounting bracket. The second end is coupled to the rail bracket. The second mounting bracket comprises a first surface and a second surface opposite the first surface. The first surface of the second mounting bracket contacts the first mounting bracket. The second surface of the second mounting bracket contacts the rail bracket.

Multi-directional, low-profile rack mounting system

Examples herein disclose a system including a board and a cooling member. The board includes a first surface, a second surface, and a midpoint between the first and the surface, the boards supports an electrical component on the first surface. The cooling member is routed along the second surface of the board and delivers cooling liquid to the electrical component by crossing the midpoint of the board from the second surface to the first surface. The cooling member routes heated liquid from the electrical component by crossing the midpoint of the board from the first surface to the second surface.

Routing a cooling member along a board

In example implementations, a memory cooler is provided. The memory cooler includes a body. The body includes two pieces that are moveable relative to one another. Each piece of the body includes an inlet manifold, an outlet manifold, and a plurality of cold plates extending between the inlet manifold and the outlet manifold. The inlet manifold is to receive liquid coolant from a liquid coolant supply line. The outlet manifold is to return the liquid coolant to the liquid coolant supply line. The liquid coolant flows from the inlet manifold to the outlet manifold through interior channels of the cold plates. The plurality of cold plates of a first piece of the body are interleaved with the plurality of cold plates of a second piece of the body such that slots to receive memory modules are defined between adjacent pairs of cold plates.

Memory coolers

A liquid-cooled integrated circuit system includes two printed circuit assemblies having removable heat spreaders and cooling pipes coated with a thermal interface material. The two printed circuit assemblies are placed together in opposition such that the top surfaces of the heat spreaders on each printed circuit assembly contacts, and become thermally coupled with, the thermal interface material on the cooling pipes of the other printed circuit assembly. In this arrangement, each printed circuit assembly is cooled by the other.

Liquid-cooled integrated circuit system

In one example implementation according to aspects of the present disclosure, a server chassis may include a server zone to receive a plurality of blade servers, each of the plurality of blade servers having a fabric connection. The server chassis may further include a flexible input/output zone to receive an input/output card, the input/output card being communicatively coupled to each of the plurality of blade servers via the fabric connection of each of the plurality of blade servers. The functionality of the input/output card may be distributed across the plurality of blade servers.

Flexible input/output zone in a server chassis

A removable electronic module usable with an electrical system includes a main body, electronic devices, indicators, and a switching member. The indicators receive the power by the power storage device when the main body is removed from a slot and electrically disconnected from the electrical system to indicate a functional status of the corresponding electronic devices when placed in an active state.

Indicate a functional status of corresponding electronic devices

Growing community of inventors

Katy, TX, United States of America

Minh H Nguyen