Ningbo Sunny Opotech Co., Ltd.

Sunny Opotech North America Inc.

Other

Mingzhu Wang

Bojie Zhao

Nan Guo

Takehiko Tanaka

Zhenyu Chen

Feifan Chen

Heng Jiang

Liang Ding

Zhen Huang

Chunmei Liu

Zhongyu Luan

Zilong Deng

Fengsheng Xi

Qimin Mei

Ye Wu

Duanliang Cheng

Hailong Liao

Lifeng Yao

Yiqi Wang

Baozhong Zhang

Zhewen Mei

Jingfei He

Bo Peng

Shoujie Wang

Yinli Fang

Shuijia Chu

Yurong Wu

Ang Ji

Xiaojuan Su

Hong Li

Huaigang Zhuang

Liefeng Chen

Kouwen Zhang

Xiaodi Liu

Yafei Wang

Wenjie Wang

Qianyou Huang

Enlai Xiang

Keqiang Xiong

Yinhuan Wang

Zhong Deng

Yongming Chen

Yutian Chen

Ze Fang

The present application provides a photosensitive assembly, comprising: a photosensitive chip, having a first surface and a second surface facing away from the first surface, the first surface having a photosensitive region; an electronic element arranged around the photosensitive chip; a molded portion formed by a molding process and packaging the electronic element and the photosensitive chip together, the molded portion having a third surface flush with the first surface; and a first re-wiring layer formed on a non-photosensitive region of the first surface and on the third surface, a pad of the photosensitive chip being electrically connected to the electronic element through the first re-wiring layer, wherein a side surface or a bottom surface of the photosensitive assembly has a conductive region, and the conductive region is electrically connected to the first re-wiring layer. The present application further provides a corresponding manufacturing method of photosensitive assembly. The present application can reduce design limitations of the photosensitive assembly; and make camera modules in mobile terminals more modularized and easy to replace.

Photosensitive assembly and manufacturing method thereof

An optical zoom camera module, including: at least two camera module components and a glue material; each of the at least two camera module components has at least one lens group, and each lens group includes at least one lens; all of the lens groups of the at least two camera module components together constitute an imageable optical system, wherein at least two of the lens groups are movable lens groups, and the at least two movable lens groups are respectively fixed with different motor carriers, so as to move separately under the driving of a motor; and the glue material, once cured, fixes and supports the at least two camera module components, so that relative positions of the at least two camera module components are maintained at relative positions determined by an active alignment. A method for assembling the optical zoom camera module is also provided.

Optical zoom camera module and assembling method therefor

A molded photosensitive assembly includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

Manufacturing method of a molded photosensitive assembly for an array imaging module

A split lens includes a first lens group including a first set of lenses, a second lens group including a second set of lenses, and at least one light shielding element. The light shielding element is disposed between the lens at the bottom position of the first lens group and the lens at the top position of the second lens group, such that a predetermined light path is formed between the first lens group and the second lens group, thereby conforming to the structure of the split lens.

Split lens and camera module and electronic apparatus

The present disclosure discloses a lens assembly, a camera module, and a method for assembling the same. An embodiment of the method for assembling a lens assembly includes: preparing a first lens subassembly and a second lens subassembly, the first lens subassembly including a first lens cylinder and a first lens, and the second lens subassembly including a second lens cylinder and a second lens; arranging the first lens subassembly on an optical axis of the second lens subassembly to form an imaging optical system comprising the first lens and the second lens; moving the first and the second lens subassemblies relatively along the optical axis, and matching an actually measured image plane of the optical system and a target plane; and connecting the first and the second lens subassemblies to fix a relative distance between the first and the second lens subassemblies along the optical axis.

Lens assembly, camera module and method for assembling same

Disclosed are a split lens assembly and a camera module. The split lens assembly comprises a first lens module and a second lens module. The first lens module is assembled to the second lens module. The first lens module and the second lens module are calibrated and assembled. A spacing that facilitates calibration is located between the first lens module and the second lens module.

Split lens assembly and camera module

A camera module is provided, including a circuit board, a photosensitive element, an optical lens, and a filter element. The circuit board includes a substrate having a substrate front surface, a substrate back surface, and a substrate channel. The substrate front surface and the substrate back surface correspond to each other, and the substrate channel extends from the substrate front surface to the substrate back surface. The photosensitive element has a photosensitive area and a non-photosensitive area surrounding the photosensitive area. A first part of the non-photosensitive area is mounted on the back surface substrate. The photosensitive element and the substrate are conductively connected. The photosensitive area and a second part of the non-photosensitive area correspond to the substrate channel. The optical lens is held in a photosensitive path of the photosensitive element. The filter element is directly mounted on the substrate front surface of the substrate.

Circuit board assembly with photosensitive element mounted to back side of circuit board

An adjustable optical lens and camera module, and manufacturing method and applications thereof is disclosed. The camera module includes an optical sensor and an adjustable optical lens. The adjustable optical lens includes an optical structural member and at least two lenses, wherein each of the lenses is arranged in an internal space of the optical structural member. Along a vertical direction of the optical structural member, at least one lens is adapted to be adjustably pre-mounted to an internal space of the optical structural member serving as an adjustable lens. The side wall of the optical structural member is provided with at least one adjustment channel, which is positioned corresponding to the adjustable lens, so that an assembling position of the adjustable lens can be adjusted through the adjustment channel so as to align a central axis line of the adjustable optical lens with a central axis line of the optical sensor.

Adjustable optical lens and camera module and manufacturing method and applications thereof

Provided are a camera module, a molding photosensitive assembly and manufacturing method thereof, and an electronic device. The molding photosensitive assembly comprises a molding portion, at least one photosensitive chip and at least one circuit board, wherein the photosensitive chip is provided on the circuit board, the molding portion comprises a molding portion main body, the molding portion main body is made of a transparent material, and the molding portion main body, the photosensitive chip and the circuit board form an integral structure by means of a molding technique, so as to facilitate production.

Molding photosensitive assembly, and camera module and electronic device containing molding photosensitive assembly

The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

Camera module, circuit board assembly and manufacturing method thereof, and electronic device with camera module

A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.

Camera module and array camera module based on integral packaging technology

Disclosed are a camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method. The photosensitive assembly includes a photosensitive chip, at least one resistance-capacitance device, an extended wiring layer, a filter element assembly, and a molded base. The filter element assembly includes a filter element and a bonding layer bonded around the filter element. The filter element assembly is attached to a top surface of the extended wiring layer, and the filter element of the filter element assembly corresponds to a light transmission hole of the extended wiring layer, so that external light is filtered by the filter element before reaching a photosensitive area of the photosensitive chip through the light transmission hole.

Camera module and photosensitive assembly thereof, electronic device, and manufacturing method

The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.

Array camera module and application thereof

A camera module and photosensitive component or unit thereof and manufacturing method therefor are provided. The photosensitive unit includes an encapsulation portion and a photosensitive portion that includes a main circuit board and a photosensitive sensor, wherein the encapsulation portion is integrally encapsulated to form on the main circuit board and the photosensitive sensor.

Camera module, and photosensitive component thereof and manufacturing method therefor

A camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method are provided. The photosensitive assembly includes a photosensitive chip having a photosensitive area and an electric connection area located around the photosensitive area, at least one resistance-capacitance device, a conducting element, an expanded wiring layer, and a molded base. The expanded wiring layer has a top surface and a bottom surface. The at least one resistance-capacitance device is electrically connected to the bottom surface of the expanded wiring layer. The conducting element extends between the bottom surface of the expanded wiring layer and the electric connection area of the photosensitive chip, so as to electrically connect the photosensitive chip to the expanded wiring layer by means of the conducting element. A light hole is formed in the expanded wiring layer, and the light hole corresponds to at least the photosensitive area of the photosensitive chip. The molded base is integrally combined with the photosensitive chip, the at least one resistance-capacitance device, and the expanded wiring layer.

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Ningbo, China

Mingzhu Wang