Avatar Integrated Systems, Inc.

Mingsheng Han

Ping-San Tzeng

Yucheng Wang

Improving an initial via in a circuit comprises: obtaining layout information associated with an initial via structure in a circuit, the initial via comprising an initial lower metal enclosure and an initial upper metal enclosure connected by an initial cut; determining layout information associated with a multiconnection via structure comprising a plurality of sibling vias having at least one additional upper metal enclosure and at least one additional lower metal enclosure; updating the layout information associated with the initial via with the layout information associated with the multiconnection via structure; and outputting the updated layout information. The plurality of sibling vias are connected by a plurality of corresponding sibling cuts, and the multiconnection via structure has lower resistance than the initial via structure. In some embodiments, the multiconnection via is efficiently represented in using a master template.

Vias with multiconnection via structures

A placed netlist is routed. A circuit is obtained that implements the placed netlist. A net in the circuit is identified to be enhanced. Space adjacent to a wire associated with the net that would accommodate a parallel wire is reserved.

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Fremont, CA, United States of America

Mingsheng Han