International Business Machines Corporation

Mingman Li

Tao Song

LiCen Mu

Zhen Wang

Xiao Liang Hu

Miao Zhang

WeiFeng Zhang

XiYuan Yin

Jia Yu Zheng

Michael Benosa Monjardin

Zhongfeng Yang

Jiayu Zheng

Zexin Luo

Lingle Guo

Susan Zhai

Automated material welding including starting a welding operation, scanning a weld in-progress, creating a simulation of the weld in-progress, detecting a flaw in the weld in-progress according to the scanning and the simulation, remediating the weld in-progress, and completing the welding operation.

Automated material welding

A reference via in a set of plated vias on a printed circuit board is located. A reference lead is applied to the reference via. A test via in the set of plated vias is located. A test lead is applied to the test via. An electrical conductance between the reference via and the test via is measured. A property of a core layer of the printed circuit board is identified based on the electrical conductance.

Method for identifying PCB core-layer properties

System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.

Image conduction apparatus for soldering inner void analysis

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Shenzhen, China

Mingman Li