Yangtze Memory Technologies Co., Ltd.

Hubei Cubic-Ruiyi Instrument Co., Ltd

Mingliang Li

Peng Chen

Jian Miao

Jun Wu

Youhui Xiong

Lipan Song

A method for taping a wafer is disclosed. A wafer taping device comprising a wafer stage is provided. A wafer is mounted and secured on the wafer stage. A tape is delivered along a first direction over the wafer. The tape is forced into adhesion with a surface of the wafer in a non-contact manner. The tape is cut along a perimeter of the wafer.

Method and device for wafer taping

The invention provides a gas flow metering gas chamber and a gas flow meter. The gas flow meter includes the gas flow metering gas chamber, a display device and a housing. The gas flow meter gas cell includes a cavity, a gas inlet, a gas outlet, two ultrasonic transducer mounting holes and a reflection device. The signal emitted by the first ultrasonic transducer installed in the first ultrasonic transducer mounting hole and the signal emitted by the second ultrasonic transducer installed in the second ultrasonic transducer mounting hole intersects with each other to form an L-shaped reflection passage. Compared with V-shaped, W-shaped, and N-shaped reflection structures, the effective distance between the two ultrasonic transducers of the present invention more is increased, the cross section of the cavity is reduced, and the rate of the gas flow is increased, which avoids contamination contained in the measured gas to contaminate the ultrasonic transducers and thereby improves the measurement accuracy.

Flow metering chamber for a gas flow meter having transducer mounting holes and fairing mounted in the gas inlet

Growing community of inventors

Wuhan, China

Mingliang Li