Intel Corporation

Mingjie Xu

Edvin Cetegen

Bassam Mohammed Ziadeh

Michael Garcia

Suzana Prstic

Zhizhong Tang

Kedar Dhane

Sung-Won Moon

Gopi Krishnan

Pan Gu

A container assembly and system for dispensing a stack of electronic device components includes an elongated tube having a cavity configured to contain a stack of said components. The tube has a dispensing end opposite an access end and a dispenser opening sized to dispense the electronic device components. The access end has an access opening sized to allow entry of a press to push the stack upwardly. A retainer is positioned proximate the access end to engage a last component in the stack and prevent it from exiting the tube through the access opening. The retainer may include a plurality of retainers. The retainer(s) can be a pair of retainers, four retainers, a chamfer formed in the tube, a perimeter insert, and/or a slidable panel. A method of making and a method of dispensing are provided.

Containers for holding and dispensing stacks of electronic device components

Creating surface variations on a stiffener in a stack reduces inter-stiffener sticking and stiffener stack tilt in pick and place media. The surface variations provide one or more airgaps that reduce inter-stiffener surface contact, provide space for contaminants and/or provide an averaged surface height due to surface roughness.

Plurality of stiffeners with thickness variation

An extended preform of a thermal interface material (TIM) is formed between a heat spreader and a die on a substrate. The preform has an extension beyond a footprint of the die. The preform is cured. A bleed out of the TIM is controlled by the extension upon curing of the preform.

Controlling thermal interface material bleed out

Growing community of inventors

Chandler, AZ, United States of America

Mingjie Xu