Changxin Memory Technologies, Inc.

MingHung Hsieh

Sheng-Hua Su

Yong Lu

Dandan Chen

Embodiments of the present application provide a semiconductor structure and its manufacturing method. The method for manufacturing a semiconductor structure includes: providing a substrate and a dielectric layer located on the substrate, the substrate being provided therein with a conductive structure; etching a certain thickness of the dielectric layer to form a first groove; performing an isotropic etching process on the dielectric layer located at the bottom of the first groove to form a second groove, a maximum width of the second groove being greater than a bottom width of the first groove in a direction parallel with a surface of the substrate; and etching the dielectric layer located at the bottom of the second groove to form a third groove exposing the conductive structure.

Semiconductor structure including a trench having a high aspect ratio formed by etching and its manufacturing method as applied to formation of a capacitor in the semiconductor structure

The present disclosure provides a method and an apparatus for setting wafer script, a device, and a storage medium. In response to the demand unit determining that the execution necessary condition of the script to be executed satisfies the business requirement based on the parameter information, the platform unit acquires the lot identification of the script to be executed and the corresponding production information. In response to the demand unit determining that the script to be executed is executed for the wafers corresponding to the script to be executed for the first time, the platform unit detects whether the first production information corresponding to the first wafers satisfies the execution necessary condition. If satisfied, the platform unit sets parameter information and assignment information for the first wafers, and synchronizes the first wafers with the set information to the material execution unit such that the material execution unit performs corresponding operation.

Method and apparatus for setting wafer script, device and storage medium

A detection method includes: determining process data of a new process; according to the process data of the new process, detecting, by a first production system, whether a wafer carrier type of the new process matches an acceptable level of a corresponding process step or not and whether the new process matches a flag of the corresponding process step or not; if not, determining that the process data does not pass the detection and outputting first detection information; or if the wafer carrier type of the new process matches the acceptable level of the corresponding process step and the new process matches the flag of the corresponding process step, detecting, by a second production system, if the second production system detects a mismatch, determining that the process data does not pass the detection and outputting second detection information.

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Hefei, China

MingHung Hsieh