Growing community of inventors

Singapore, Singapore

Minghui Hong

Average Co-Inventor Count = 3.18

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 51

Minghui HongWen Dong Song (4 patents)Minghui HongYong Feng Lu (3 patents)Minghui HongYongfeng Lu (3 patents)Minghui HongChengwu An (3 patents)Minghui HongWendong Song (1 patent)Minghui HongKaidong Ye (1 patent)Minghui HongYan Zhou (1 patent)Minghui HongEe Jen Wilson Wang (1 patent)Minghui HongBoris Lukiyanchuk (1 patent)Minghui HongZuyong Wang (1 patent)Minghui HongEng San Thian (1 patent)Minghui HongLianwei Chen (1 patent)Minghui HongZuyong Wang (0 patent)Minghui HongMinghui Hong (9 patents)Wen Dong SongWen Dong Song (5 patents)Yong Feng LuYong Feng Lu (8 patents)Yongfeng LuYongfeng Lu (4 patents)Chengwu AnChengwu An (4 patents)Wendong SongWendong Song (4 patents)Kaidong YeKaidong Ye (3 patents)Yan ZhouYan Zhou (2 patents)Ee Jen Wilson WangEe Jen Wilson Wang (2 patents)Boris LukiyanchukBoris Lukiyanchuk (2 patents)Zuyong WangZuyong Wang (1 patent)Eng San ThianEng San Thian (1 patent)Lianwei ChenLianwei Chen (1 patent)Zuyong WangZuyong Wang (0 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Data Storage Institute (7 from 34 patents)

2. National University of Singapore (1 from 816 patents)

3. Phaos Technology Pte. Ltd. (1 from 1 patent)


9 patents:

1. 12228717 - Microsphere holder

2. 10842611 - Tissue scaffold device and method for fabricating thereof

3. 7170029 - Method and apparatus for deflashing of integrated circuit packages

4. 6838637 - Method and apparatus for deflashing of integrated circuit packages

5. 6835319 - Method of patterning a substrate

6. 6828524 - Method and apparatus for cleaning inkjet cartridges

7. 6822189 - Method of laser marking and apparatus therefor

8. 6777642 - Method and apparatus for cleaning surfaces

9. 6753500 - Method and apparatus for cutting a substrate using laser irradiation

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as of
1/16/2026
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