Nxp B.v.

Mingda Huang

Cicero Silveira Vaucher

Leo Van Gemert

Maristella Spella

Yu Lin

Waqas Hassan Syed

Marcello Ganzerli

Antonius De Graauw

Daniele Cavallo

Markus Carolus Antonius Van Schie

A communication unit, such as a radar unit () includes a plurality of cascaded millimetre wave, mmW, transceiver, TRx, circuit, each comprising at least one phase shift circuit () and each coupled to respective antennas; and a signal processor circuit () operably coupled to the plurality of cascaded mmW TRx circuits and configured to process transmit and receive signals of the plurality of cascaded mmW TRx circuits. The radar unit () further comprises: a first TRx circuit () of the plurality of cascaded mmW TRx circuits being configured to wirelessly transmit () a signal to a second TRx circuit () via a respective antenna; a localization processing circuit () operably coupled to at least one of the first TRx circuit () and second TRx circuit () and configured to wirelessly determine a distance relationship () between at least one antenna coupled to the first TRx circuit () and at least one antenna coupled to the second TRx circuit (); and a phase control unit (), operably coupled to the localization processing circuit () and configured to adjust at least one phase shifter () in response to the wirelessly determined distance relationship.

Communication unit, integrated circuits and methods for cascading integrated circuits

An integrated circuit package is described comprising an integrated circuit die and an antenna structure coupled to the integrated circuit die and comprising a stacked arrangement of metal and dielectric layers, wherein a first metal layer includes a planar antenna and at least one further metal layer comprises an artificial dielectric layer. The integrated circuit package may improve the directionality of the antenna and reduces the sensitivity of the antenna to the printed circuit board on which the integrated circuit package is mounted.

Integrated circuit package

Consistent with an example embodiment, a System on Chip (SoC) device operates in millimeter wave frequencies. The SoC device comprises, a silicon device having at least one differential pair pad, the at least one differential pair pad having a shunt inductor coupled thereon. A parasitic capacitance on at least one differential pair pads is tuned out by resonance of the shunt inductor. A package has a redistribution layer (RDL), with an array of contact areas to which the silicon device is mounted and then encapsulated. A connection corresponds to the at least one differential pair pad and the connection is located about an outer row or column of the array of contact areas.

IC-package interconnect for millimeter wave systems

The invention provides a testing circuit for testing a connection between a chip and external circuitry. A current source is used to inject a DC current towards the connection to be tested from the chip side. On-chip ESD protection is provided giving a path between the connection to be tested and a fixed voltage line. A shunt path is also coupled to the connection to be tested on the external circuitry side. It is determined if the current source current flows through the ESD protection circuit, and this can be used to determine whether or not the connection to be tested presents an open circuit for the DC test current.

Growing community of inventors

Eindhoven, Netherlands

Mingda Huang