Sabic Global Technolgoies B.v.

Shpp Global Technologies B.v.

Sabic Innovative Plastics IP B.v.

Mingcheng Guo

Yaqin Zhang

Wei Zhang

Jian Wang

Tong Wu

Dennis Karlik

Shijie Song

David Zou

Mark Van Der Mee

Yubin Bao

Fen Zhang

Frans Mercx

Roy l'Abee

Yun Zheng

Liang Shen

Yunan Cheng

Narong An

Ying Na

Yuxian An

Qingya Shen

Shengying Qian

Roy I'ABEE

A thermoplastic composition includes, based on the total weight of the composition: from 20 wt % to 90 wt % of a primary thermoplastic resin including a polycarbonate component; from 0.5 wt % to 30 wt % of a functional filler including electrically conductive carbon powder, carbon nanotubes, or a combination thereof; from 0 wt % to 20 wt % of a second thermoplastic resin; and from 0 wt % to 40 wt % of at least one additional additive. The polycarbonate component includes at least 5 wt % of a poly(aliphatic ester)-polycarbonate copolymer based on the total weight of the polycarbonate component, and the combined weight percent value of all components does not exceed 100 wt %. The thermoplastic composition may be useful in, e.g., molded articles, including as a carrier tape for an electronic component.

Poly(aliphatic ester)-polycarbonate filled compositions

A reinforced poly(phthalamide) composition comprising 20-80 weight percent of a poly(phthalamide) component comprising 15-55 weight percent of a crystalline poly(phthalamide), and 5-45 weight percent of an amorphous poly(phthalamide); 0.5-60 weight percent of a reinforcing filler; and 0.1-50 weight percent of an additive composition; wherein weight percent is based on the total weight of the reinforced poly(phthalamide) composition and totals 100; and wherein the reinforced poly(phthalamide) composition has a capillary melt viscosity, measured according to ASTM D3835 (2015) at 320&#xb0; C., at 5000 s, that is at least 10% lower than that of the same reinforced poly(phthalamide) composition without the amorphous poly(phthalamide), and a warpage that is at least 15% lower than that of the same reinforced poly(phthalamide) composition without the amorphous poly(phthalamide).

High flow poly(phthalamide) compositions, and articles made therefrom

The disclosure concerns thermally conductive polymer compositions comprising: (a) from about 20 wt % to about 80 wt % of at least one polymer component; (b) from greater than about 0 wt % to about 70 wt % of a thermally conductive filler; and (c) from about 0.1 wt % to about 40 wt % of a laser activatable additive having a core-shell structure; wherein the core comprises an inorganic filler and the shell comprises a laser activatable component; wherein the combined weight percent value of all components does not exceed about 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein a molded sample of the blended thermoplastic composition has a through plane thermal conductivity of at least about 0.40 W/m&#xb7;K when determined in accordance with ASTM E1461.

Composition with thermal conductivity and laser plating performance by core-shell structure LDS additive with metal compounds coated on mineral filler surface

Thermally conductive compositions include from about 20 wt. % to about 80 wt. % of a polycarbonate polymer, from about 0.5 wt. % to about 30 wt. % of an impact modifier, and a thermal conductivity modifier. The thermal conductivity modifier includes from about 0.5 wt. % to about 10 wt. % of a high density polyethylene polymer, from about 0.5 wt. % to about 10 wt. % of a maleic anhydride type copolymer, or from about 0.01 wt. % to about 10 wt. % of an acid component. In some aspects the thermally conductive compositions have a notched Izod impact strength of at least about 30 J/m, a through-plane thermal conductivity of at least about 0.4 W/mK and/or an in-plane thermal conductivity of at least about 1.0 W/mK. Methods for making the compositions and articles formed according to the methods are also described.

Polycarbonate-based thermal conductivity and ductility enhanced polymer compositions and uses thereof

The present disclosure provides graphite-containing compositions that exhibit favorable thermal conductivity characteristics.

Preparation of high thermally conductive polymer compositions and uses thereof

A poly(phenylene ether) composition comprises, based on the total weight of the poly(phenylene ether), addition polymer, impact modifier, and flame retardant: 40 to 90 weight percent of a poly(phenylene ether); 1 to 20 weight percent of an addition polymer comprising repeat units derived from a glycidyl ester of an &#x3b1;,&#x3b2;-ethylenically unsaturated acid; 1 to 20 weight percent of an impact modifier other than the addition polymer; and 5 to 20 weight percent of a flame retardant comprising an organophosphate ester. The composition is useful for molding articles.

Poly(phenylene ether) composition and article

The invention concerns compositions comprising (a) from about 20 wt % to about 80 wt % of a polymer component; (b) from about 10 wt % to about 70 wt % of a flame retardant component; and (c) from about 0.01 wt % to about 5 wt % of an acid component; wherein the combined weight percent value of all components does not exceed 100 wt %; wherein all weight percent values are based on the total weight of the composition; and wherein the composition has: (i) a thermal conductivity of at least about 1.5 W/mK for through plane thermal conductivity; (ii) flame retardancy of at least VI at 0.8 mm using the UL94 test standard; and (iii) melt volume flow rate of at least 10 g/cm3 using ASTM D 1238.

Flame retardant thermally conductive polymer compositions with good flow property and uses thereof

A composition includes specific amounts of a poly(phenylene ether), a polystyrene-poly(ethylene-butylene)-polystyrene triblock copolymer, an organophosphate ester, and compound that improves adhesion to potting silicone sealant. The adhesion promoter can be a phenolic compound, a hydroxysilyl-terminated polydiorganosiloxane, or a combination thereof. The composition is particularly useful for molding parts of photovoltaic junction boxes that utilize potting silicone sealant as an internal electrical insulator.

Disclosed herein are thermally conductive blended polycarbonate compositions with improved flame retardant properties. The resulting compositions, comprising a polycarbonate polymer, a phosphorus-containing flame retardant, a metal hydroxide, optionally an anti-dripping agent, and optionally a silicone-containing char-forming agent, can be used in the manufacture of articles requiring thermally conductive materials with improved flame retardant properties such as electronic devices. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

Polycarbonate based thermally conductive flame retardant polymer compositions

Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a thermally insulative filler with an intrinsic thermal conductivity less than or equal to 10 W/mK; and c. from 5 to 15 vol % of a thermally conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; ii. a thermal conductivity of at least 7 times the total filler volume fraction times the thermal conductivity of the pure thermoplastic polymer; and iii. a volume resistivity of at least 10Ohm&#xb7;cm. Also disclosed are articles and methods of use therefor.

Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof

Disclosed herein are compositions comprising a. from 35 to 80 vol % of a thermoplastic polymer; b. from 5 to 45 vol % of a low thermally conductive, electrically insulative filler with an intrinsic thermal conductivity of from 10 to 30 W/mK; c. from 5 to 15 vol % of a high thermally conductive, electrically insulative filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK; and d. from 5 to 15 vol % of a high thermally conductive, electrically conductive filler with an intrinsic thermal conductivity greater than or equal to 50 W/mK, wherein the composition is characterized by: i. a thermal conductivity of at least 1.0 W/mK; and ii. a volume resistivity of at least 10Ohm.cm. Also disclosed are articles and methods of use therefor.

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Shanghai, China

Mingcheng Guo