Boe Technology Group Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Boe Mled Technology Co., Ltd.

Beijing Boe Display Technology Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Boe Technology Groupco., Ltd.

China Institute of Water Resources and Hydropower Research

Hefei Boe Ruisheng Technology Co., Ltd.

Beijing Boe Technology Co., Ltd.

Hefei Boe Pixey Technology Co., Ltd.

Boe Meld Technology Co., Ltd.

Beijing Boe Chatani Electronics Co., Ltd.

Ming Zhai

Haiwei Sun

Pei Li

Xiaoliang Fu

Yutao Hao

Jinpeng Li

Shubai Zhang

Pengjun Cao

Liguang Deng

Zhiqiang Fan

Ting Tian

Shuqian Dou

Zhiyuan Wang

Dayong Zhou

Jian Li

Yu Liu

Shuo Wang

Chao Liu

Teng Zhang

Pei Qin

Jing Wang

Lili Wang

Lu Yu

Litao Fan

Yanjun Liu

Yufei Liu

Yuanda Lu

Sha Feng

Yawen Zhang

Yongjie Han

Taesung Kang

Mingming Jia

Zewen Gao

Jun Cheng

Dan Li

Liang Gao

Jian Sang

Dong Zhang

Hai Tang

Hyungkyu Kim

Yali Zhang

Zhiqiang Zhang

Chiachiang Lin

Zijian Wang

Pengfei Cheng

Jia Meng

Kangle Chang

Qin Xin

Zongying Shu

Chuhang Wang

Wenfeng Jin

Enkai Dong

Youcai Yang

Jinge Zhao

Yingming Liu

Jian Zhang

Shuo Li

Lingyun Shi

Jing Li

Jiantao Liu

Zhen Wang

Long Wang

Qi Qi

Huan Wang

Guangquan Wang

Qing Zhang

Bing Zhang

Yujie Liu

Tingting Zhao

Hui Sun

Zhen Chen

Junjie Ma

Liqiang Wang

Site Cai

Shipeng Wang

Jingjing Zhang

Yinwei Chen

Jianwei Qin

Qingqing Ma

Pan Guo

Tao Jia

Ruifeng Yang

Wei Huang

Jinzhao Zhou

Xiaolin Geng

Meiling Jin

Jingfu Tao

Zhiyong Chen

Bangcan Xue

Dongjia Hao

Xiaopan Che

Yinan Gao

Tianjiao Wang

Linxia Qi

Zhongjun Wang

Yongqiang Jiang

Jinmiao Tang

Moyu Zhu

Yin Yuan

Meijuan An

A display panel includes a display substrate having a display area and at least one wiring area, and a protective film including a first protective portion and at least one second protective portion. The first protective portion is disposed on a display side of the display substrate, and covers the display area. The at least one second protective portion each covers a wiring area in the at least one wiring area, and is bent from the display side of the display substrate to a non-display side of the display substrate, by a side of the display substrate. The at least one second protective portion each includes a main film layer and a wiring layer. The wiring layer includes a plurality of wirings. At least one wiring extends from the display side of the display substrate to the non-display side of the display substrate, by the side of the display substrate.

Display panel and manufacturing method thereof, and display device

A display module includes a display panel with a plurality of bonding electrodes arranged at intervals along a selected side edge of a non-display surface and divided into two bonding electrode groups, a first flexible circuit board and a second flexible circuit board. For the first flexible circuit board, each first conductive contact piece in a first wiring region is connected to a bonding electrode in a first bonding electrode group. For the second flexible circuit board, each second conductive contact piece in a second wiring region is connected to a bonding electrode in a second bonding electrode group. The first wiring region is closer to the selected side edge than the second wiring region in a first direction. The first fan-out region is spaced apart from the second wiring region in a second direction perpendicular to the first direction.

Display module and method for manufacturing the same, and display device

A light-emitting substrate includes a substrate, and a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate. The reflective layer has a plurality of openings, and the plurality of openings include a plurality of first openings; a light-emitting device is located in a first opening. A surface of the reflective layer away from the substrate has a plurality of protruding structures.

Light-emitting substrate and method of manufacturing the same, backlight module and display apparatus

The present disclosure provides a backplane, including: a transparent substrate; an electrode layer provided on a side of the transparent substrate and including a plurality of signal transmission lines; a plurality of micro-display light emitting devices provided on a side, facing away from the transparent substrate, of the electrode layer, electrically coupled to the signal transmission lines, and capable of emitting light towards the transparent substrate; a protective layer provided on a side, facing away from the transparent substrate, of the micro-display light emitting devices; and a driving module provided on a side, facing away the transparent substrate, of the protective layer and electrically coupled to the signal transmission lines. The present disclosure also provides a display substrate and a display device.

Backplane, display substrate and display device

A display panel includes a backplane, back traces, side traces and blocking portions. The backplane includes a display surface, a non-display surface, and side surfaces connected to the two surfaces, where a side surface is a selected side surface. The back traces and the blocking portions are arranged on the non-display surface. Each back trace includes a first line segment and a second line segment, whose extension directions intersect. The side traces are arranged on the selected side surface. Of each side trace, an end is on the display surface, and the other end is on the non-display surface. Each side trace is electrically connected to a first line segment in a respective back trace, where the first line segment has the same extension direction as the other end of each side trace. Two adjacent first line segments are provided with a blocking portion therebetween.

Display panel, display device and tiled display apparatus

The present application provides an array base plate and a detecting method thereof, and a light emitting apparatus, which relates to the technical field of displaying. The array base plate includes: a substrate, wherein the substrate includes a plurality of first light transmitting areas; and a first conductive layer located on the substrate; the first conductive layer includes a plurality of conductive-pad groups, and each of the conductive-pad groups includes at least one conductive pad; an overlapping area exists between an orthographic-projection area of the conductive pad on the substrate and one of the first light transmitting areas; and a transmittance of parts of the substrate that are located at the first light transmitting areas is greater than or equal to a first preset value.

Array base plate and detecting method thereof, and light emitting apparatus

A backplane includes: a substrate including a circuit structure layer and a second reflective layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in a through hole. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.

Backplane and method for manufacturing the same, and display device

An array substrate, a method of manufacturing the array substrate, and a display device are provided. The array substrate includes: a transparent rigid base; light-emitting chips on the transparent rigid base, each light-emitting chip including a chip body and a pin coupled to the chip body, a light-exiting surface of the chip body facing towards the transparent rigid base, and the pin being on a side of the chip body facing away from the transparent rigid base; a driving wire layer on a side of the pin facing away from the transparent rigid base; and a driving chip structure on a side of the driving wire layer facing away from the transparent rigid base. The driving chip structure is coupled to pins of the plurality of light-emitting chips through the driving wire layer, and is used for provide driving signals for the light-emitting chips.

Array substrate, method of manufacturing the same, and display device

A display substrate includes a base substrate, a plurality of light-emitting units, a protecting layer and a connecting line. The base substrate is a transparent substrate, and the plurality of light-emitting units, the protecting layer and the connecting line are laminated in sequence along a direction distal from the base substrate. A via is arranged in the protecting layer, one end of the connecting line is connected to the plurality of light-emitting units through the via, and the other end of the connecting line is configured to connect to a driving circuit of a display apparatus.

Display substrate, spliced display panel and display apparatus

The present disclosure provides a flexible circuit board, a light bar, a light source and a display device. The light source includes a flexible circuit board having at least one effective welding portion and a light bar having at least one effective pad, the at least one effective welding portion being in one-to-one correspondence with the at least one effective pad, and the effective welding portion being fixed to a corresponding effective pad to transmit a signal loaded by itself to the corresponding effective pad. The flexible circuit board further includes at least one auxiliary welding portion, the light bar further includes at least one auxiliary pad that is in one-to-one correspondence with the at least one auxiliary welding portion, and the auxiliary welding portion is fixed to a corresponding auxiliary pad to enhance the firm fixing between the flexible circuit board and the light bar.

Flexible circuit board, light bar, light source and display device

A backplane includes: a substrate including a circuit structure layer, a first reflective layer disposed on a bearing surface of the substrate, a plurality of light-emitting diode chips, and a plurality of optical structures. The first reflective layer includes a plurality of through holes spaced apart. A light-emitting diode chip in the plurality of light-emitting diode chips is located in one of the plurality of through holes. The plurality of light-emitting diode chips are electrically connected to the circuit structure layer. The circuit structure layer is configured to drive the plurality of light-emitting diode chips to emit light. An optical structure in the plurality of optical structures covers the light-emitting diode chip, a light incident surface of the optical structure is in contact with a light exit surface of the light-emitting diode chip, and a light exit surface of the optical structure is a curved surface.

The present application proposes a display panel and a display device, the display panel includes a liquid crystal display module, a reflective film and a fingerprint identification module. The liquid crystal display module is on a first side of the reflective film, and the fingerprint identification module is on a second side of the reflective film opposite to the first side. The fingerprint identification module includes an invisible light emitting unit and an invisible light sensor. The invisible light emitting unit is configured to emit invisible light in a direction towards the reflective film, and the invisible light sensor is configured to receive reflected invisible light. The reflective film is configured to transmit the invisible light and reflect visible light reaching the reflective film through the liquid crystal display module.

Display panel and display device

Disclosed are an electronic signboard and a wall hanging device. The electronic signboard includes a display device and a wall hanging device. The display device is provided with a first fitting portion, and the wall hanging device is provided with a second fitting portion detachably connected to the first fitting portion. The wall hanging device is further provided a fixing surface via which the wall hanging device is fixed to a mounting base.

Electronic signboard and wall hanging device

The vertical counterforce loading device includes a concrete support member, four transfer components, four connection components, a vertical force transmission component and a load test soil layer. The concrete support member is formed by pouring and concreting below the load test soil layer. The four transfer components are divided into two groups to be symmetrically and parallelly anchored in the concrete support member. The vertical force transmission component includes a load plate, a jack, a primary beam and a secondary beam arranged in sequence from bottom to top. The load plate is installed on the load test soil layer. Two secondary beams are connected crosswise to both ends of the primary beam, where end portions of the secondary beams are respectively connected to second ends of the connection components through reinforcement components. The device can improve work efficiency, reduce construction costs and improve safety.

Vertical counterforce loading device for large-tonnage soil material load test and loading method thereof

This disclosure discloses a light-emitting diode chip, a method for fabricating the same, a backlight module, and a display device. The light-emitting diode chip includes: a transparent base substrate; at least one light-emitting diode located on one side of the base substrate; and a dimming structure located on a side of the base substrate away from the light-emitting diode, wherein the light-emitting diode is configured to emit light from double sides thereof; and the dimming structure is configured to adjust the intensity of light emitted from the side of the base substrate away from the light-emitting diode.

Light-emitting diode chip, method for fabricating the same, backlight module, and display device

Growing community of inventors

Beijing, China

Ming Zhai