Taiwan Semiconductor Manufacturing Comp. Ltd.

Ming-Yuan Song

Shy-Jay Lin

Chien-Min Lee

Xinyu Bao

Yen-Lin Huang

Tzu-Chiang Chen

Hung-Li Chiang

Tung-Ying Lee

Wilman Tsai

Chung-Te Lin

Carlos H Diaz

Hon-Sum Philip Wong

Katherine H Chiang

Nuo Xu

A circuit with a logical function of a computing-in-memory (CiM) operation, a memory device and a method thereof are provided. The circuit includes a first switch controlled by a first input data, a second switch controlled by an inverted first input data, a first and a second SOT MRAM cells, and a third switch controlled by a write word line. The first and the second SOT MRAM cells have a first and a second current paths for setting states of the first and the second SOT MRAM cells. In response to the third switch is turned-on, the state of the first SOT MRAM cell is different from the state of the second SOT MRAM cell. One of the state of the first SOT MRAM cell and the state of the second SOT MRAM cell is read according to one of the inverted first input data and the first input data.

Circuit with logical function of computing-in- memory, memory device, and method thereof

A memory device is provided. The memory device includes a substrate, a spin-orbit torque layer and a magnetic tunneling junction (MTJ). The MTJ stacks with the spin-orbit torque layer over the substrate and includes a synthetic free layer, a barrier layer and a reference layer. The synthetic free layer includes a synthetic antiferromagnetic structure, a first spacer layer and a free layer, wherein the synthetic antiferromagnetic structure is disposed between the spin-orbit torque layer and the free layer. The barrier layer is disposed beside the synthetic free layer. The reference layer is disposed beside the barrier layer.

Memory device

Memory stacks, memory devices and method of forming the same are provided. A memory stack includes a spin-orbit torque layer, a magnetic bias layer and a free layer. The magnetic bias layer is in physical contact with the spin-orbit torque layer and has a first magnetic anisotropy. The free layer is disposed adjacent to the spin-orbit torque layer and has a second magnetic anisotropy perpendicular to the first magnetic anisotropy.

MRAM stacks, MRAM devices and methods of forming the same

Provided are a memory device and a method of forming the same. The memory device includes: a selector; a magnetic tunnel junction (MTJ) structure, disposed on the selector; a spin orbit torque (SOT) layer, disposed between the selector and the MTJ structure, wherein the SOT layer has a sidewall aligned with a sidewall of the selector; a transistor, wherein the transistor has a drain electrically coupled to the MTJ structure; a word line, electrically coupled to a gate of the transistor; a bit line, electrically coupled to the SOT layer; a first source line, electrically coupled to a source of the transistor; and a second source line, electrically coupled to the selector, wherein the transistor is configured to control a write signal flowing between the bit line and the second source line, and control a read signal flowing between the bit line and the first source line.

Methods of writing and forming memory device

A memory device includes a substrate, a spin-orbit torque (SOT) layer, a magnetic tunneling junction (MTJ) film stack, a connecting via and a shielding structure. The SOT layer is disposed on the substrate. The MTJ film stack is formed over SOT layer and on the substrate. The connecting via is disposed on and electrically connected to the MTJ film stack. The shielding structure is laterally surrounding the MTJ film stack and disposed on the SOT layer, wherein the shielding structure includes a first dielectric layer, a high magnetic permeability layer and a second dielectric layer, the first dielectric layer is in contact with the SOT layer and the MTJ film stack, and the high magnetic permeability layer is sandwiched between the first dielectric layer and the second dielectric layer.

Memory device and method of fabricating the same

A semiconductor device including a semiconductor substrate and an interconnect structure is provided. The semiconductor substrate includes a transistor, wherein the transistor has a source region and a drain region. The interconnect structure is disposed over the semiconductor substrate, wherein the interconnect structure includes a plurality of interlayer dielectric layers, a first via and a memory cell. The plurality of interlayer dielectric layers are over the semiconductor substrate. The first via is embedded in at least two interlayer dielectric layers among the plurality of interlayer dielectric layers and electrically connected with the drain region of the transistor. The memory cell is disposed over the at least two interlayer dielectric layers among the plurality of interlayer dielectric layers and electrically connected with the first via.

Memory device, semiconductor device, and method of fabricating semiconductor device

MRAM stacks and memory devices

A memory device and a memory circuit is provided. The memory device includes a spin-orbit torque (SOT) layer, a magnetic tunnel junction (MTJ), a read word line, a selector and a write word line. The MTJ stands on the SOT layer. The read word line is electrically connected to the MTJ. The write word line is connected to the SOT layer through the selector. The write word line is electrically connected to the SOT layer when the selector is turned on, and the write word line is electrically isolated from the SOT layer when the selector is in an off state.

Memory device, operation method of memory device and operation method of memory circuit

Memory device, method of forming the same, and memory array

Memory device and memory circuit

A memory device and a memory circuit is provided. The memory device includes a magnetic tunnel junction (MTJ), a read word line, a read selector, a write word line and a write selector. The read word line is connected to the MTJ with the read selector in between. The read word line is electrically connected to the MTJ when the read selector is turned on, and electrically disconnected from the MTJ when the read selector is in an off state. The write word line is connected to the MTJ with the write selector in between. The write word line is electrically connected to the MTJ when the write selector is turned on, and electrically disconnected from the MTJ when the write selector is off. A turn-on voltage of the write selector is greater than a turn-on voltage of the read selector.

Growing community of inventors

Hsinchu, Taiwan

Ming-Yuan Song