Stats Chippac Pte. Ltd.

St Assembly Test Services Inc.

Nanyang Polytechnic

Ming Ying

Seng Guan Chow

Il Kwon Shim

Roger Alan Emigh

Byung Hoon Ahn

Lip Seng Tan

Ii Kwon Shim

Chee Teck Phua

Boon Chong Gooi

See Hoon Kam

A method for manufacturing an integrated circuit package system includes: providing a leadframe; forming a protruding pad on the leadframe; attaching a die to the leadframe; electrically connecting the die to the leadframe; and encapsulating at least portions of the leadframe, the protruding pad, and the die in an encapsulant.

Integrated circuit protruding pad package system and method for manufacturing thereof

The present invention provides an apparatus and method for non-invasively sensing pulse rate and blood flow anomalies using a localized, uni-directional, and constant magnetic field. The apparatus comprises a magnetic source for producing the magnetic field, a signal acquisition module with a magnetic sensor for detecting the modulations of the magnetic field caused by the blood flow; and a signal processing module for processing the acquired signals so as to produce data of pulse rate and blood flow anomalies. The method senses pulse rate and blood flow anomalies by providing a localized, uni-directional, and constant magnetic field in proximity to a blood vessel; detecting the variations of the magnetic field caused by the flow of pulsatile blood within the blood vessel; and processing the signals of the detected variations so as to monitor the blood flow.

Apparatus and method for non-invasively sensing pulse rate and blood flow anomalies

An integrated package system with die and package combination includes forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and encapsulating a second integrated circuit over the first integrated circuit.

Integrated circuit package system with die and package combination

A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.

Semiconductor package system with substrate having different bondable heights at lead finger tips

An integrated circuit package system is provided. A protruding pad is formed on a leadframe. A die is attached to the leadframe. The die is electrically connected to the leadframe. At least portions of the leadframe, the protruding pad, and the die are encapsulated in an encapsulant.

Integrated circuit protruding pad package system

A system is provided for an integrated circuit package including a leadframe with a lead finger. A groove is in a lead finger for a conductive bonding agent and a passive device is in the groove to be held by the conductive bonding agent.

Semiconductor package with passive device integration

An integrated package system with die and package combination including forming a leadframe having internal leads and external leads, encapsulating a first integrated circuit on the leadframe, and encapsulating a second integrated circuit over the first integrated circuit.

The present invention provides a package stacking lead frame system comprising forming a lead frame interposer including a dual row of terminal leads positioned around a die attach pad, mounting a first die on the die attach pad, wherein the first die is connected to the dual row of terminal leads, molding a molding compound around the first die and the dual row of terminal leads and mounting a second integrated circuit package on the lead frame interposer, wherein the second integrated circuit package size is independent of the first die size.

Package stacking lead frame system

A semiconductor package includes a substrate. A crenellated spacer is attached to the substrate. At least one top die is attached to the crenellated spacer. The at least one top die is wire bonded to the substrate, and an encapsulant is formed over the crenellated spacer and the at least one top die.

Stacked die packaging and fabrication method

A system is provided for an integrated circuit package including a leadframe having a lead finger. A groove is formed in a lead finger for a conductive bonding agent and a passive device is placed in the groove to be held by the conductive bonding agent.

Growing community of inventors

Singapore, Singapore

Ming Ying