Sandisk Semiconductor (shanghai) Co. Ltd.

Gauss Lasers Tech (shanghai) Co., Ltd.

Shanghai Tree-graph Blockchain Institute

Ming Wu

Chee Keong Chin

Junrong Yan

Shrikar Bhagath

Guang Yang

Gokul Kumar

Kim Lee Bock

Xiaofeng Di

Chong Un Tan

Fengyu Zhang

Fan Long

Jian Bin Gu

Harjashan Singh

Shiyun Zhou

Hongyan Ren

Peilun Li

Xueyuan Hu

Chenxing Li

Hang Ni

Tongxin Li

Tuanjie Zhang

Shian Zhou

The method includes: performing blockchain storage area allocation for transaction broadcast data; establishing a peer-to-peer transmission mechanism and a trust mechanism between nodes by the blockchain; acquiring network transaction broadcast data that needs to be subjected to blockchain storage; and recording, storing and managing the network transaction broadcast data; where the network transaction broadcast data is managed by dividing blockchain data into hot data and cold data; the hot data is stored in each of the blockchain nodes; and the cold data is divided into N parts to be correspondingly stored in N nodes of the blockchain nodes; and the hot data is data that needs to be frequently accessed by computing nodes, and the cold data is data that is infrequently accessed.

Method and system for reducing storage overhead of blockchain nodes, and storage medium

Embodiments of systems and methods for medical treatment using a series of pulsed lasers are disclosed. In an example, a system for medical treatment includes a laser source, an optical module, and a controller coupled to the optical module. The laser source is configured to generate a series of pulsed lasers. The optical module is configured to provide a series of focused laser spots on a patient based on the series of pulsed lasers. The controller is configured to control the at least one of the optical module and a stage for holding the patient to move the series of focused laser spots on the patient to form a scan pattern.

Systems and methods for medical treatment using a series of pulsed lasers

A semiconductor device is disclosed including semiconductor die formed with a row of functional die bond pads and an adjacent row of dummy die bond pads. The functional die bond pads may be electrically connected to the integrated circuits formed within the semiconductor die. The dummy die bond pads may be formed in the scribe area of a semiconductor wafer from which the semiconductor die are formed, and are provided for wire bonding the semiconductor die within the semiconductor device.

Semiconductor device including dual pad wire bond interconnection

A semiconductor device is disclosed that is formed with die bond pads at an edge of the semiconductor die. The die bond pads may be formed partially in a kerf area between semiconductor die on a wafer. When the wafer is diced, the die bond pads are severed along their length, leaving a portion of the die bond pads exposed at an edge of the diced semiconductor die. Having die bond pads at the edge of the die minimizes the offset between die when stacked into a package.

Semiconductor device including die bond pads at a die edge

Growing community of inventors

Shanghai, China

Ming Wu