Fukui Precision Component (shenzhen) Co., Ltd.

Zhen Ding Technology Co., Ltd.

Huawei Technologies Co., Limited

Foxconn Advanced Technology Inc.

Shenzhen Lanhe Technologies Co., Ltd.

Shenzhen Vantop Technology & Innovation Co., Ltd.

Fukui Precision Compnent (shenzhen) Co., Ltd.

Ming Wang

Ping Chen

Cheng-Hsien Lin

Chih-Yi Tu

Wen-Chin Lee

Hua Zhu

Gang Yao

Gang Wu

Dong-Qing He

Xijun Xue

Xiaoqing Wu

Xianmiao Luo

Bowang Dong

Yun-Li Zhu

Jianlong Cao

Zheng Yan

Xiao-Hong Zhang

Cui Yang

Jin Zhu

Rui Fang

Ge Shen

Zhe Tao

Zhiqiang Luo

Case for electronic device

A fault detection method includes: obtaining a scheduling table of a target task, where the scheduling table is used to indicate at least one test pattern, the at least one test pattern is used to detect a fault in a target logic circuit, and the target logic circuit is a logic circuit configured to execute the target task; and executing the at least one test pattern based on the scheduling table, to detect the fault in the target logic circuit.

Fault detection method and related apparatus

Projector

A signal processing method and apparatus includes determining a first signal F(t) output by a first neuron, processing the first signal F(t) using q orders of synapse weight parameters w(t), w(t), . . . , w(t) to obtain a second signal F(t), and inputting the second signal F(t) to a second neuron, where the second neuron is in a layer immediately subsequent to that of the first neuron.

Signal processing method and apparatus based on spiking neural network

An exemplary simulation system for manufacturing a printed circuit board is provided. The simulation system includes at least one simulation sub-system. The simulation sub-system includes an input module, a storing module, a processing module, and an output module. The input module is configured for acquiring a number of processing parameters associated with steps of a process for manufacturing the printed circuit board. The storing module is configured for storing a number of simulation functions relating to the steps of the process for manufacturing the printed circuit board. The processing module is configured for selecting and performing the corresponding simulation function according to the acquired parameters, thereby obtaining a simulation result. The output module is configured for output the simulation result.

Simulation system and method for manufacturing printed circuit board

A flexible printed circuit board includes a base and a coverlay. The base includes a main portion and a distal portion connecting with the main portion. The distal portion has a first part and a second exposed part. The coverlay is formed on the base and covers the main portion and the first part of the distal portion. The second exposed part of the distal portion is uncovered by the coverlay. The coverlay includes a curved edge serving as an interface between the first part and second part of the distal portion.

Flexible printed circuit board having curved edge

The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a first end and a second end. The first end is connected to the first conductive portion; the second end is connected to the second conductive portion. A width of the connecting portion gradually decreases from the first end to the second end. Reflection and cross talk of signals transmitted in the presented printed circuit board can be reduced.

Printed circuit boards

A method for manufacturing a printed circuit board (PCB) having different thicknesses in different areas includes: providing a first substrate having two lateral unwanted portions bounded two imaginary boundary lines, a binder layer having a through opening and a second substrate having a mounting area for mounting electronic elements; forming two slots bounded the imaginary boundary lines in an intermediated unwanted portion of the first substrate corresponding to the mounting area; laminating the first and second substrates, and the binder layer with the mounting area exposed via the through opening; filling the two slots and the through opening with a filling material, thereby obtaining a semifinished PCB board; cutting the semifinished PCB board along the imaginary boundary lines to remove the two lateral unwanted portions and a portion of the second substrate corresponding to the two lateral unwanted portions; and removing the intermediate unwanted portion and the filling material.

Method for manufacturing printed circuit board having different thicknesses in different areas

A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder layer; defining a first slit on the first copper clad laminate; laminating the first copper clad laminate, the binder layer and the second copper clad laminate; defining a via hole for establishing electric connection between the first copper clad laminate and the second copper clad laminate; cutting the first copper clad laminate, the binder layer and the second copper clad laminate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

Method for manufacturing multilayer flexible printed circuit board

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Shenzhen, China

Ming Wang