Ubotic Company Limited

Ming-Wa Tam

Ken Lik Hang Wan

Wa San Leung

A method of manufacturing, a carrier, and a semiconductor package are provided. The method involves depositing a plurality of conductive vias, applying a molding material over the lead frame, grinding the molding material to expose the plurality of conductive vias, and depositing a metalized pattern over the molding material. The carrier is manufacture by this method and the semiconductor package is formed based on the carrier.

Carrier substrate, package, and method of manufacture

A mass flow sensor module and method of manufacture thereof are provided, wherein a semiconductor sensor die is integrated within an enhanced molded housing structure that maintains an air tight seal and protects the die from abrasive wear, and which also provides laminar flow of the liquid gas to be sensed. Since the die is embedded in the substrate; there is no need for a spacer for reducing die thickness induced flow turbulence. Moreover, the die surface is at the same level as the top surface of the substrate, such that there is no performance impact due to die thickness variation and therefore no die attach bond line thickness control requirement. In one embodiment, a thermal enhancement capability is provided.

Mass flow sensor module and method of manufacture

A method of manufacture and a substrate for sensor packages is provided. The method involves premolding a lead frame with strips having V-grooves; cutting the substrate partially, and plating the exposed surfaces of the lead frame. The method subsequently involves attaching a die to a dies pad and connecting wires between the die and leads to form a sensor package. The sensor package is separated from the substrate by snapping along the score line. The substrate for assembly of sensor packages as well as substrate of sensor packages is manufactured using at least part of the method of manufacture.

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Hong Kong, China

Ming-Wa Tam