United Microelectronics Corp.

Ming-Tsung Yeh

Ji-Fu Kung

Wei-Lun Hsu

Yan-Hsiu Liu

Yung-Chien Kung

Yao-Pi Hsu

Am-Tay Luy

Ching-Pei Lin

Chuan-Guei Wang

A manufacturing data analyzing method and a manufacturing data analyzing device are provided. The manufacturing data analyzing method includes the following steps. Each of at least one numerical data, at least one image data and at least one text data is transformed into a vector. The vectors are gathered to obtain a combined vector. The combined vector is inputted into an inference model to obtain a defect cause and a modify suggestion.

Manufacturing data analyzing method and manufacturing data analyzing device

An integrated circuit (IC) structure includes a substrate having several regions, several semiconductor devices formed at the substrate and respectively within the regions, and an ultra-deep (UD) trench isolation structure formed in the substrate. The substrate has a top surface and a bottom surface oppositely, and the UD trench isolation structure formed in the substrate surrounds peripheries of each of the regions for structurally and physically isolating the semiconductor devices within different regions. The UD trench isolation structure penetrates the substrate by extending from the top surface of the substrate to the bottom surface of the substrate.

Integrated circuit structure with semiconductor devices and method of fabricating the same

Growing community of inventors

Taipei, Taiwan

Ming-Tsung Yeh