Innolux Corporation

Red Oak Innovations, LLC

Ming-Tsang Wu

Chia-Chieh Fan

Shan-Shan Hsu

Chin-Lung Ting

Cheng-Chi Wang

Jia-Sin Li

Pai-Chi Tsai

Chun-Sheng Yen

An electronic device is provided. The electronic device includes a supporting board, multiple circuit boards, a gap, and a molding material. The circuit boards are disposed on the supporting board. Each circuit board includes a substrate and multiple semiconductor elements. The semiconductor elements are disposed on the substrate. The gap is disposed between two adjacent circuit boards. The molding material is disposed on the supporting board and covers the circuit boards and the gap. The electronic device of the embodiment of the disclosure can improve uniformity of product appearance or uniformity of a display image.

Electronic device

An electronic device including a substrate, a circuit structure, two adjacent supporting elements and another two adjacent supporting elements is provided. The flexible substrate has a first surface and comprises a region connected with a circuit board. The circuit structure is disposed on the first surface. The two adjacent supporting elements are disposed on the first surface and separated by a first distance. The another two adjacent supporting elements are disposed on the first surface and separated by a second distance, wherein the two adjacent support elements are farther away from the region than the another two adjacent support elements, and the first distance is less than the second distance.

An electronic device is provided. The electronic device includes a housing, a driving circuit assembly, an adhesive layer, and a flexible circuit board. The driving circuit assembly is disposed on the housing. The adhesive layer is disposed between the housing and the driving circuit assembly. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the driving circuit assembly. The flexible circuit board overlaps the opening. The housing and the driving circuit assembly are connected to each other by the first adhesive segment and the second adhesive segment.

An electronic device including a flexible substrate, a plurality of light emitting units, and a plurality of supporting elements is provided. The flexible substrate has a first surface and a second surface opposite to each other. The light emitting units are disposed on the first surface. The supporting elements are disposed on the second surface. The supporting element includes an arc-shaped structure.

An electronic device is provided. The electronic device includes a backlight module, a display panel, an adhesive layer, and a flexible circuit board. The display panel is disposed on the backlight module. The adhesive layer is disposed between the backlight module and the display panel. The adhesive layer includes an opening. The flexible circuit board is electrically connected to the display panel. The flexible circuit board overlaps the opening.

A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, forming a resin layer on the sacrificial layer, disposing first chips on the sacrificial layer, and forming a first dielectric layer having trenches and surrounding the first chips, wherein an upper surface of the first dielectric layer and an upper surface of the resin layer are at a same plane.

Manufacturing method of semiconductor device

A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, disposing first chips on the sacrificial layer, forming a first dielectric layer surrounding the first chips, forming trenches in the first dielectric layer, and forming a second dielectric layer in the trenches, wherein an upper surface of the first dielectric layer and an upper surface of the second dielectric layer are at a same plane.

A display device includes a first substrate, a second substrate, a first polarizer, a second polarizer and a frame. The frame contacts with a first surface and a first side of the first substrate, a second surface and a second side of the second substrate, and a third side of the first polarizer. The frame has a fourth surface and a fourth side connecting to the fourth surface, and the fourth side is disposed corresponding to the second side. In a first direction perpendicular to the first surface, a shortest distance between the fourth and first surfaces is a first distance, a shortest distance between the fourth and first surfaces is a second distance, and a shortest distance between the third and first surfaces is a third distance. The third distance is substantially equal to the first distance, and the first distance and the second distance are different.

Growing community of inventors

Miao-Li County, Taiwan

Ming-Tsang Wu