Advanced Semiconductor Engineering, Inc.

Ming-Tau Huang

Kuei-Hao Tseng

Yu-Jung Chang

Hung-I Lin

Yu-Chih Lee

Ming-Wei Hsieh

A semiconductor device package comprises a first substrate, a first electronic component, an encapsulant, and a feeding structure. The first substrate has a first surface and a second surface opposite the first surface. The first electronic component is disposed on the first surface of the first substrate. The encapsulant encapsulates the first electronic component on the first surface of the first substrate. The feeding structure is disposed on the second surface of the first substrate without covering.

Semiconductor device package and acoustic device having the same

The present disclosure provides a wearable device. The wearable device includes a first element and a second element. The first element is configured to sense a bio-signal from a user. The second element is configured to transmit the bio-signal to a processor. The second element has a first surface and a second surface non-coplanar with the first surface. The first element is in contact with the first surface and the second surface of the second element.

Wearable device

A wireless earphone comprises a battery, a speaker and a chamber/space. The battery has a first surface, a second surface opposite the first surface, and a third surface extended between the first surface and the second surface. The battery is disconnected from any protecting circuits. The speaker is disposed adjacent to the first surface of the battery. The chamber/space is defined by the battery and the speaker. The chamber/space is devoid of any electronic component.

Semiconductor device package and acoustic device including the same

The present disclosure provides an ear tip. The ear tip includes a main body, a first conductive element at least partially embedded in the main body, a second conductive element at least partially embedded in the main body and spaced apart from the first conductive element. The main body includes a central portion having a top and a tail portion extending from the top of the central portion. The first conductive element is proximal to the top of the central portion and the second conductive element is distal from the top of the central portion. A wearable device is also disclosed.

Eartip and a wearable device including an eartip

The present disclosure provides a semiconductor a semiconductor device package includes a substrate, an electronic component disposed on the substrate, a package body disposed on the substrate and encapsulating the electronic component, and a capacitor disposed above the electronic component. The capacitor is exposed from the package body.

Semiconductor device package

An acoustic device includes a first chamber, a first through hole, a vibration structure, and a separation structure. The first chamber includes a first end and a second end. The first through hole is defined at the first end of the first chamber. The vibration structure is disposed at the second end of the first chamber and is configured to transmit an acoustic wave away from the first chamber. The separation structure is disposed within the first chamber and divides the first chamber into a first sub-chamber and a second sub-chamber. The separation structure defines a second through hole connecting the first sub-chamber and the second sub-chamber.

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Kaohsiung, Taiwan

Ming-Tau Huang