Chunghwa Picture Tubes, Ltd.

Ming-Tan Hsu

I-Cheng Shih

Ke-Horng Chen

Yu-Cheng Tung

Tai-Ming Lin

Shao-Keng Huang

Chien-Fang Peng

Shih-Min Chen

Sheng-Hui Chang

Tzung-Ling Tsai

A touch display module and an assembly method thereof are provided. The touch display module includes a backlight module, a cover plate, a display panel, a touch panel, a first adhesive layer, a second adhesive layer, a third adhesive layer and a fourth adhesive layer. The cover plate and the backlight module are disposed oppositely. The display panel is disposed between the backlight module and the cover plate. The touch panel is disposed between the display panel and the cover plate. The first adhesive layer covers around the backlight module, the display panel and the touch panel and a back portion of the backlight module. The second adhesive layer is disposed between the backlight module and the display panel. The third adhesive layer is disposed between the display panel and the touch panel. The fourth adhesive layer is disposed between the touch panel and the cover plate.

Touch display module and assembly method thereof

The present invention provides a bonding structure of circuit substrates for instant circuit inspecting. The connecting wire design of the bonding structure has an instant inspection ability of circuit connection in bonding two circuit substrates. In two bonded circuit substrates, the signal inputted at the circuit part passes the conductive particles to the first connecting wire, and then passes the conductive particles again to the detecting part from the first connecting wire. Therefore, measuring the output signal can inspect the reliability of the circuit connection of the bonded circuit substrates. If the output signal is the same as the input signal, the bonding structure between the first connecting wire and the circuit part is validated, or, if not, the bonding structure is invalidated.

Bonding structure of circuit substrate for instant circuit inspecting

The present invention provides a bonding structure of circuit substrates and an instant circuit inspection method thereof. The contact pad design of the bonding structure has an instant inspection ability of circuit connection in bonding two circuit substrates. In two bonded circuit substrates, the signal inputted at the circuit part passes the conductive particles to the first contact pad, and then passes the conductive particles again to the detecting part from the first contact pad. Therefore, measuring the output signal can inspect the reliability of the circuit connection of the bonded circuit substrates. If the output signal is the same as the input signal, the bonding structure between the first contact pad and the circuit part is validated, or, if not, the bonding structure is invalidated.

Bonding structure of circuit substrate and instant circuit inspection method thereof

An organic electro-luminescence display apparatus including a substrate, data lines and scan lines, a plurality of first, second and third organic electro-luminescence units, at least one first source driver, second source driver and third source driver and a gate driver is provided. Data lines and scan lines are disposed on the substrate to define a plurality of pixel areas. Each first, second, and third organic electro-luminescence unit is disposed in corresponding pixel area. Each first, second, and third organic electro-luminescence unit is electrically connected with one of the data lines and scan lines correspondingly. Each source driver is disposed at one side of the substrate. The data lines electrically connected with the first, second and third organic electro-luminescence units are electrically connected with corresponding source drivers. The gate driver is disposed at another side of the substrate and electrically connected with the scan lines. The luminous efficiency can be enhanced.

Organic electro-luminescence display apparatus

A digital-to-analog data converter for converting a digital input signal to an analog output signal is provided. The digital-to-analog data converter includes a register, a decoder, a converting unit and an output unit. During a first period, the decoder decodes least significant bits, and takes the decoded least significant bits as a first control signal for controlling the converting unit to output a first converting current according to the first control signal. During a second period, the decoder decodes most significant bits, and takes the decoded most significant bits as a second control signal for controlling the converting unit to output a second converting current according to the second control signal. The output unit registers the first converting current during the first period, amplifying the second converting current, and combining the amplified second converting current with the registered first converting current as the analog output signal during the second period.

Digital-to-analog data converter and method for conversion thereof

A boost DC/DC converter, including a mask circuit, a switched boost circuit, a pulse width modulation (PWM) circuit and an AND gate, is provided. The mask circuit is used to output a mask signal according to a load current. In the present invention, the system can selectively operate in the pulse width modulation mode, the pulse frequency modulation (PFM) mode or the mixed pulse mask mode according to the mask signal corresponding to the load current when the system is under light load, medium load or heavy load respectively, so as to achieve optimal system efficiency.

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Miaoli County, Taiwan

Ming-Tan Hsu