Azurewave Technologies, Inc.

Ming-Tai Kuo

Chung-Er Huang

A manufacturing method for a packaging structure of SIP (system in package) includes the following steps. First step is providing a substrate having electronic devices thereon. Second step is covering the electronic devices by a mixture of a molding compound and a conductive polymer precursor so as to form a molding structure, wherein the substrate, the electronic devices and the molding structure forms a collective electronic module. Third step is separating the collective electronic module into a plurality of individual electronic modules. Fourth step is performing a doping step by using a doping element for transforming the conductive polymer precursor in the mixture into a conductive layer near the surface of the molding structure. Therefore, the manufacturing method is optimized for forming a shielding structure of the SIP module.

Packaging structure of SIP and a manufacturing method thereof

A wireless receiving and transmitting device includes a casing unit, an antenna unit, a substrate unit, a projection unit and an electrical connector unit. The casing unit has a casing. The antenna unit has an antenna module fixed in the casing. The substrate unit has a circuit substrate movably disposed in the casing and electrically connected to the antenna module. The projection unit has a projection element positioned on one end of the circuit substrate. The projection element has a bottom portion selectively exposed outside the casing or hidden in the casing according to the move of the circuit substrate, and the projection element has a top portion always exposed outside the casing. The electrical connector unit has an electrical connector position on another end of the circuit substrate, and the electrical connector is selectively exposed outside the casing or hidden in the casing.

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Taipei, Taiwan

Ming-Tai Kuo