Advanced Optoelectronic Technology, Inc.

Zhongshan Innocloud Intellectual Property Services Co., Ltd.

Ming-Ta Tsai

Chao-Hsiung Chang

Hou-Te Lin

Chih-Hsun Ke

Chung-Min Chang

Hao-Xiang Lin

Min-Shun Yang

Ching-Chung Chen

Shiun-Wei Chan

Yu-Wei Tsai

Pu-Xian Hsu

Pei-Ying Wang

A light emitting diode (LED) lamp includes a hollow connector, an LED module mounted on the connector, and a fin unit received in the connector. The connector has an inlet and an outlet couple to the inlet. Heat generated from the LED module is transferred to the connector to dissipate. The fan unit includes a first fan and a second fan rotating along contrary directions.

Light emitting diode lamp

An LED light bulb includes a holder for electrically connecting with a power source, an LED mounted on the holder, an envelope mounted on the holder and covering the LED, and a light dispersing plate attached to an inner surface of the envelope. The light dispersing plate is made of a transparent material with a plurality of irregular air bubbles therein. Light generated by the LED and radiating to the envelope is refracted, reflected and scattered by the bulbs before the light emits out of the LED light bulb.

Light emitting diode light bulb having a light dispersing layer attached on an envelope thereof

A light emitting diode (LED) lamp includes a substrate, a plurality of LED elements arranged on the substrate, and a reflector arranged on the substrate. The reflector includes a plurality of reflecting sheets obliquely extending upward and outward from a center of the substrate. A projection of each of the reflecting sheets covers one LED element. Each of the reflecting sheets corresponding to the LED element defines a perforation. Part of light from the LED element directly radiates out via the perforation, and part of light from the LED package is reflected to a lateral periphery of the substrate by the reflecting sheet.

An LED lamp includes a supporting base and a reflector having a plurality of reflecting tabs mounted thereon. The reflector includes many circumferentially arranged tabs around a central axis of the supporting base. Many LED light sources are mounted in the supporting base and divided into an outer array and an inner array. Each reflecting tab has a fixed end connected to the supporting base and a free end distant from the supporting base. Each reflecting tab extends upwardly and outwardly from a central portion of the supporting base toward an outer periphery thereof. The inner array of the LED light sources is surrounded by the reflector. A hole is defined in a free end of each reflecting tab and aligned with one of the LED light sources of the outer array. A lamp mounting base is also provided.

Lamp mounting base and light emitting diode lamp incorporating the same

An LED light source device includes a printed circuit board (PCB) and a plurality of LED light sources located on the PCB and electrically connected with the PCB. The plurality of LED light sources are arranged symmetrically relative to a center point of the PCB, and a distance between every adjacent two LED light sources decreases along a direction away from the center point of the PCB. An optical lens is located over the LED light sources for diverging light from a central one of the LED light sources.

Light emitting diode (LED) light source device having uniform illumination

An LED lamp includes an envelope, a circuit board, a plurality of LEDs, a lamp body and a lamp holder. The LEDs are arranged on the circuit board. The envelope covers the LEDs. The lamp body is connected between the envelope and the lamp holder. The lamp body includes a first chamber and a second chamber. The lamp body defines therein a plurality of first channels and a second channels. The first channels are defined adjacent to the envelope. The second channels are defined in the vicinity of the lamp holder.

LED lamp

A light source apparatus includes a light guide plate, a number of optical fibers, at least two first light emitting diodes, and at least two second LEDs. Each fiber has a light exiting surface facing the light guide and at least two light entrances at both ends of the fiber. The second LEDs are located on both sides of the light guide plate. Light generated by the first LEDs has a wavelength longer than that generated by the second LEDs. The light generated from the first LEDs enters the light guide plate after travelling through the optical fiber to mix with the light generated from the second LEDs to provide a good color rendering property of the light generated by the light source.

Light source apparatus of backlight module

A method of manufacturing an LED package including steps: providing an electrode, the electrode including a first electrode, a second electrode, a channel defined between the first electrode and the second electrode, the first electrode and the second electrode arranged with intervals mutually, a cavity arranged on the first electrode, and the cavity communicating with the channel; arranging an LED chip electrically connecting with the first electrode and the second electrode and arranged inside the cavity; providing a shield covering the first electrode and the second electrode; injecting a transparent insulating material to the cavity via the channel, and the first electrode, the second electrode, and the shield being interconnected by the transparent insulating material; solidifying the transparent insulating material to obtain the LED package.

Method for manufacturing LED package

An LED module comprises an LED and a lens matching with the LED. The lens comprises a light-guiding portion and a plurality of retaining portions protruded from the light-guiding portion. The LED includes a substrate, a first electrode and a second electrode mounted on the substrate. A plurality of through holes is defined in the first electrode and a second electrode, respectively. Each retaining portion includes a rugged portion. The retaining portions are inserted into the through holes correspondingly, and the rugged portion abuts the substrate. Glue is applied between the rugged portion and the substrate.

LED module

An LED package includes a substrate, an electrode layer, a light-emitting chip, a reflection cup and an encapsulation. The substrate includes a first surface, an opposite second surface, and two side surfaces. The electrode layer is consisted of a positive electrode and a negative electrode, each of which extends from the first surface to the second surface via a respective side surface. The light-emitting chip is located on the first surface of the substrate and electrically connected to the electrode layer. The reflection cup comprises a first part covering the electrode layer on the side surfaces of the substrate, a second part with a bowl-like shape on the first surface of the substrate and surrounding the light-emitting chip. The encapsulation is filled in the second part of the reflection cup.

Light emitting diode package having a portion of reflection cup material covering electrode layer on side surfaces of substrate

A method for manufacturing a plurality of holders each being for an LED package structure includes steps: providing a base, pluralities of through holes being defined in the base to divide the base into a plurality of basic units; etching the base to form a dam at an upper surface of each of the basic units of the base; forming a first electrical portion and a second electrical portion on each basic unit of the base, the first electrical portion and the second electrical portion being separated and insulated from each other by the dam; providing a plurality of reflective cups each on a corresponding basic unit of the base, each of the reflective cups surrounding the corresponding dam; and cutting the base into the plurality of basic units along the through holes to form the plurality of holders.

Manufacturing method of LED package structure

An LED package comprises a substrate, a reflector, a light-absorbable layer, an encapsulation layer and an LED chip. The reflector comprises a first incline with an inclined angle surrounding the LED chip. The light-absorbable layer comprises a second incline with another inclined angle direct to the LED chip, wherein the inclined angle of the second incline is greater than that of the first incline and the inclined angle of the first incline is between 90 to 150 degrees.

LED package

An LED package includes an electrode, an LED chip, and an insulation layer. The electrode includes a first electrode and a second electrode. The first electrode and the second electrode are separate from each other. The LED chips are connected to the first and second electrodes. The insulation layer covers the first and second electrodes and the LED chip. A cavity is defined in the first electrode for receiving the LED chip therein. A channel is defined between the first electrode and the second electrode. The channel communicates with the cavity and the insulation layer fills in the cavity and the channel.

LED package and method for manufacturing the same

An LED device includes a substrate, an LED chip and a lens module. The substrate has an upper surface. The LED chip is arranged on the upper surface of the substrate. The LED chip has a light emitting surface away from the upper surface of the substrate. The lens module is arranged over the light emitting surface of the LED chip. The lens module includes a first lens. The first lens includes a first light outputting surface away from the light emitting surface of the LED chip. The first light outputting surface of the first lens defines a first cavity at a center thereof.

Light emitting diode device with lens having a cavity

An LED package includes a substrate, a blue LED chip, an encapsulant and a fluorescent layer. The blue LED chip is arranged on the substrate. The encapsulant covers the blue LED chip. The fluorescent layer is arranged on a top surface of the encapsulant. The fluorescent layer includes a first fluorescent area above the blue LED chip and a second fluorescent area encircling the first fluorescent area. The first fluorescent area includes red fluorescent substance and green fluorescent substance mixed therein. The second fluorescent area includes yellow fluorescent substance mixed therein.

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Hsinchu, Taiwan

Ming-Ta Tsai