United Microelectronics Corp.

Ming-Sung Wu

Chien-Ju Wu

Chih-Jen Chang

Tseng-Lung Chen

A method for fabricating a pattern on a semiconductor substrate, comprising the steps of: (a) providing the semiconductor substrate having a photosensitive layer thereon; (b) transmitting the semiconductor substrate to an exposure apparatus including several tubes; (c) providing the supporting assembly to support the tubes, where the supporting assembly includes a first supporting rod having several first parallel recesses, a second supporting rod disposed opposite to the first supporting rod, a bridging member connected to one end of the first supporting rod or one end of the second supporting rod; and a rolling member received by the bridging member; (d) providing a photomask to the exposure apparatus; and (e) transferring the pattern from the photomask to the photosensitive layer.

Method for fabricating pattern using supporting assembly with rolling member disposed below supporting rods and semiconductor fabrication apparatus having the supporting assembly

A supporting assembly configured to support a plurality of tubes includes a first supporting rod, a second supporting rod opposite to the first supporting rod, a bridging member, and a rolling member. The first supporting rod includes several first parallel recesses. The bridging member is connected to one end of the first supporting rod or one end of the second supporting rod. The rolling member is received by the bridging member.

Supporting assembly with a rolling ball disposed directly below supporting rods and method for using the same

An exposure has at least two wafer pads for holding wafers at the same time to perform different tasks including exposing a wafer, aligning a wafer, and loading or unloading a wafer synchronously. The exposure of the invention includes an exposing unit, a wafer supporting unit and a alignment beam scan unit. The wafer-supporting unit contains at least two wafer pads for holding wafers. The alignment beam scan unit contains an interferometer for detecting the interference patterns formed by the alignment beams and the alignment marks on the wafers. The tasks of aligning a wafer, and exposing a wafer, or loading/unloading a wafer can be performed on the wafers placed on each individual wafer pad synchronously.

Growing community of inventors

Tainan, Taiwan

Ming-Sung Wu