Taiwan Semiconductor Manufacturing Comp. Ltd.

Ming-Sung Kuo

Po-Wei Chen

Chung-Cheng Chen

Hsun-Kuo Hsiao

Fang-yu Liu

Ping-Cheng Ko

Jhih-Yuan Yang

To-Yu Chen

Chiun-Chieh Su

Chih-Shun Chu

A measurement pattern for monitoring overlay shift of bonded wafers includes a top wafer pattern and a bottom wafer pattern. The top wafer pattern includes a first portion with a width Wx1 measured along a first axis. The bottom wafer pattern includes a first part with a width Wx2 measured along the first axis, wherein the first portion of the top wafer pattern and the first part of the bottom wafer pattern are separated by a target distance Dx, and wherein the measurement pattern satisfies the following measurement formulas:

Method for measuring overlay shift of bonded wafers

A measurement pattern for monitoring overlay shift of bonded wafers includes a top wafer pattern and a bottom wafer pattern. The top wafer pattern includes a first portion with a width Wxmeasured along a first axis. The bottom wafer pattern includes a first part with a width Wxmeasured along the first axis, wherein the first portion of the top wafer pattern and the first part of the bottom wafer pattern are separated by a target distance Dx, and wherein the measurement pattern satisfies the following measurement formulas:2;1;

Measurement pattern and method for measuring overlay shift of bonded wafers

An apparatus for storing and transporting semiconductor elements includes a first portion and a second portion. The first portion includes a first front side wall, a first rear side wall, a top wall, and at least one pin holder integrally extending from the first rear side wall. The second portion includes a second front side wall, a second rear side wall, a bottom wall, and at least one pivotal pin structure integrally coupled with and extending from the second rear side wall. The at least one pivotal pin structure comprises a shaft, and a head connected with the shaft. The at least one pin holder defines a cavity sized and shaped to accept the head of the at least one pivotal pin structure. The first portion and the second portion are pivotally movable between an open configuration and a closed container configuration.

Apparatus for storing and transporting semiconductor elements, and method of making the same

An electromagnetic inspection tool which includes a stage configured to support a wafer having a first surface and an emitter configured to emit electromagnetic waves to be incident on the first surface. The electromagnetic inspection tool further includes a detector configured to detect electromagnetic waves returned from the first surface and a charging mechanism configured to charge the first surface. A method of electromagnetically inspecting a wafer which includes loading a wafer having a first surface onto a stage and emitting electromagnetic waves to be incident on the first surface. The method further includes detecting electromagnetic waves returned from the first surface and charging the first surface prior to detecting the electromagnetic waves returned from the first surface.

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Hsin-Chu, Taiwan

Ming-Sung Kuo