Amicro Semiconductor Co., Ltd.

Sino Nitride Semiconductor Co.ltd

Ming Sun

Qinwei Lai

Zhuobiao Chen

Hewen Zhou

Wu Yang

Zexin Chen

Jingquan Lu

Wenrong Zhuang

Junjie Ren

Songzhou Xu

Disclosed are a cleaning path planning method based on a pathfinding cost, a chip, and a cleaning robot. The method includes step 1, configuring cleaning lines in a map matching a cleaning area according to map boundaries and obstacle boundaries in different directions in the cleaning area of a mobile robot; step 2, setting a candidate entrance/exit satisfying a preset pathfinding cost condition and found in a current non-cleaned sub-block by the mobile robot at a current position as a cleaning entrance position of the current non-cleaned sub-block; step 3, controlling the mobile robot to move to the cleaning entrance position of the current non-cleaned sub-block; step 4, searching for and planning a cleaning entrance position and a cleaning termination position of a next non-cleaned sub-block by repeating steps 2-3 described above in a case of the mobile robot moves to the cleaning termination position of the current non-cleaned sub-block.

Cleaning path planning method based on pathfinding cost, chip, and cleaning robot

A laser lift-off integrated apparatus includes a laser light source configured to perform laser lift-off on a wafer to undergo lift-off, a lift-off chamber configured to bear the wafer to undergo lift-off, a heater configured to provide temperature required by the wafer to undergo lift-off during a lift-off process, a profile measuring device configured to acquire surface profile information of the wafer to undergo lift-off, and a movable device configured to, according to the surface profile information acquired by the profile measuring device, adjust a height of the wafer to undergo lift-off such that a focus of the laser light source is at a position where the wafer to undergo lift-off is to undergo lift-off.

Laser lift-off integrated apparatus

Growing community of inventors

Guangdong, China

Ming Sun