Taiwan Oasis Technology Co., Ltd.

Ability Enterprise Co., Ltd.

Ming-Shun Lee

Ping-Ru Sung

Wei-Long Lee

Shih-Meng Liao

Chih-Wei Liu

Wen-Fa Kuo

Hsien-Chang Lee

Ming-der Lin

Chang-Wei Ho

A negative potential inducing device has a box body, an AC/DC converter, a booster, a second wire, a lid and an insulating rod. The box body has a side wall, and the side wall has a via. The AC/DC converter is arranged inside the box body, and electrically connected with a plug through a first wire. The booster is arranged inside the box body and electrically connected with the AC/DC converter. The second wire passes through the via, wherein one end of the second wire is electrically connected with the booster. The lid covers the box body. A metal wire on another end of the second wire is exposed and inserted to one end of the insulating rod and touches the insulating rod.

Negative potential inducing device

A light emitting device controls its mixed CCT by the configuration of at least one light emitter, at least one diode and at least two power distribution components. The present disclosure is mainly based on the hardware design of diode and jumper, which effectively replaces the resistors and manual switches of the conventional light emitting device with diodes, wherein the resistors and the manual switches of the conventional light emitting device cause voltage instability and other problems. The present disclosure can achieve the demand for miniaturization of the light emitting device by plugging the jumper into pins, and further can achieve the main advantages of stabilizing the voltage of the overall light emitting device, thereby stabilizing the luminous performance of the overall light emitting device, and emitting the mixed light with the required CCT. The present disclosure also illustrates a lamp assembly using the aforementioned light emitting device.

Light emitting device and lamp assembly

A control module and an electronic device having the same are disclosed. The control module includes a control panel, a return component, and a conductive element. The control panel includes a conductive port. The return component is disposed on the control panel. The return component includes a first end and a second end, and the return component is electrically contacted with the conductive port. The conductive element includes a first sidewall and a second sidewall. The conductive element is electrically contacted with the first end or the second end.

Control module and electronic device having the same

A lamp tube coupler is that an insulation terminal seat is respectively disposed to two ends of an expansible outer cylinder. A pair of electrode coupling members is disposed to each insulation terminal seat. The electrode coupling members corresponding to each other at the two ends of the expansible outer cylinder form a conduction mode through respective springs. While using every lamp tube coupler, the coupler is disposed between the two lamp tubes. The electrode coupling members at two ends are respectively inserted into the electrode sockets of the two lamp tubes to achieve the goal of cascading at least two lamp tubes.

Lamp tube coupler

A chip packaging overflow proof device includes a chip disposed on a substrate; a circuit connected to the chip being provided to each of both sides of the substrate; both of the substrate and the chip being placed in a packaging base; a socket being each provided on both sides of the packaging base to receive insertion by a lid; a first cable-terminating hole being provided between the socket and the lid to permit the circuit to penetrate through; one or a plurality of retaining wall being disposed on the packaging base at where closer to the socket; a second cable-terminating hole being provided on the retaining hole; an overflow space being defined between the retaining wall and the socket; the overflow space being disposed at a level lower than that of the second cable-terminating hole; and the overflow space accepts any squeeze-out from a chip packaging colloid.

Chip packaging overflow proof device

A multi-wavelength LED construction and its manufacturing process having respectively coated on the base layer and the position above the peripheral of the light emitting chip a fluorescent material of a specific wavelength to be excited to provide higher light emitting efficiency and expected light color without mutual interference when the chip is conducted so to facilitate quality control of the multi-wavelength LED.

Multi-wavelength LED provided with combined fluorescent materials positioned over and underneath the LED component

An LED packaging construction has a chip embedded on a recessed carrier on substrate; conduction circuits with different electrodes being disposed to the peripheral of the carrier; electrode layer of chip being connected to conduction circuits with golden plated wire; fluorescent powder being filled in the carrier before mounting the colloid on the powder layer; coverage of colloid extending to substrate to complete LED packaging; larger binding range between colloid and substrate yielding better strength and increased light-emitting angle of the chip through the colloid.

LED packaging

Light emitting diode positioning structure

An improved LED positioning structure includes a retaining holder and a cover; multiple slots being disposed on one side of the retaining holder; a slope externally extending beneath each slot gradually and externally extending a slope; a hole connecting through each slot being formed on the bottom of the slope; a positioning channel at the top of the retaining holder for LED pins to respectively penetrate each hole, thus each pin being placed in a slot; a bent part of each pin being formed by the curvature located between the slot and the positioning channel to position the LED mask in the positioning channel; and the cover being positioned at top of the slot to secure the LED in place.

LED positioning structure

An LED chip capping construction to enhance luminance of the LED containing a condenser capping over a chip of the LED; a condensing part of the condenser protruding through a carrier and surrounded by multiple condensing aspects; the source light from the chip passing the condenser and consistently reflected to each condensing aspect due to the medium characteristics of the condenser.

LED chip capping construction

The present invention describes a light emitting diode illumination apparatus made of a light bulb base, a heat dissipating device, a plastic lid, a drive substrate, a metal substrate, a circular insulated base and a casing, and the heat dissipating device is in contact with the metal substrate in normal conditions, such that the heat source produced by each light emitting diode is conducted to the heat dissipating device through the metal substrate and then conducted from the heat dissipating device to the light bulb base for effectively dispersing the heat source and maintaining the light emitting efficiency of each light emitting diode.

Growing community of inventors

Taipei, Taiwan

Ming-Shun Lee