Hiwin Technologies Corporation

Ming-Shiou Liu

Chen-Ming Wong

Yan-Yu Chen

Yan-Shun Huang

Mei-Yu Huang

A gripper device includes a base and two gripping assemblies, each including a gripping member, a stand, and an elastic member. The gripping member includes a gripping portion and a supporting portion. The stand is movably disposed to the base and includes a connecter and a supporter. The supporting portion is pivotally connected to the supporter at a position between the gripping portion and the connecter so that the gripping member is pivotable relative to the stand. Two opposite ends of the elastic member are respectively connected to the supporting portion and the connecter. When one of the gripping portions touches an object, the gripping member pivots relative to the corresponding stand. Therefore, gripping a target may not be interrupted by interference objects around the target.

Gripper device

A method for detecting positions of wafers includes: rotating a rotation table with a wafer thereon in a first direction at a first speed; detecting a contour of the wafer rotating in the first direction at the first speed to provide contour data; rotating the rotation table in a second direction at a second speed when an aiming feature of the wafer passes the detector in the first direction at the first speed; detecting the contour of the wafer rotating in the second direction at the second speed to provide new contour data; and stopping the rotation of the rotation table and the detection of the wafer according to an accumulation of contour data and corresponding rotation angles, to estimate an eccentric position of the wafer and a position of the aiming feature when the aiming feature passes the detector in the second direction at the second speed.

Method and apparatus for detecting positions of wafers

A system for eliminating interference of randomly stacked workpieces is disclosed. The system includes a three-dimensional sensing module, a pick-up apparatus and a control module. The control module is coupled to the three-dimensional sensing module and the pick-up apparatus. The control module is configured to control the three-dimensional sensing module to capture a three-dimensional image, analyze the three-dimensional image to obtain an image information, select a target workpiece to be picked up according to the image information, arrange an interference elimination path for the target workpiece, and control the pick-up apparatus to eliminate interference of the target workpiece according to the interference elimination path.

System for eliminating interference of randomly stacked workpieces

A method includes selecting a candidate image property data set and a corresponding candidate light source parameter set, obtaining multiple adjusted light source parameter sets based on the candidate light source parameter set, projecting light onto an article and capturing images in multiple projecting modes, one by one, according to the adjusted light source parameter sets, obtaining multiple adjusted image property data sets each from the images captured in one projecting mode, and selecting a target image property data set from the adjusted image property data sets and a corresponding target light source parameter set.

Adaptive method for a light source for inspecting an article

A mechanical end-effector changer includes a first connection unit and a second connection unit. The first connection unit has mounted therein multiple movable members and mating elastic members. Subject to the linking relationship between each movable member and the respective elastic member, the first connection unit and the second connection unit can be automatically connected together or detached from each other, facilitating end-effector change.

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Taichung, Taiwan

Ming-Shiou Liu