Elite Semiconductor Memory Technology, Inc

Promos Technologies, Inc

Ming-Sheng Tung

Yueh-Chuan Lee

Hung-Kwei Liao

Tza-Hao Wang

Jin-Yang Huang

Disclosed is a method for enhancing temperature efficiency, used to enhance a temperature efficiency resulted from temperature changes in regard to an oscillating period of an oscillator. The method for enhancing temperature efficiency comprises the steps as follows: generating a PTAT current by using a bandgap circuit; generating a CTAT current by using a bandgap circuit; generating an output current, wherein the output current equals to PTAT current minus CTAT current; and providing the output current to an oscillator for generating an oscillating frequency.

Method for enhancing temperature efficiency

An oscillation control circuit for a ring oscillator includes a bandgap reference circuit and an oscillation frequency control circuit. The bandgap reference circuit is arranged for generating a bandgap reference signal by mirroring a proportional-to-absolute-temperature current. The oscillation frequency control circuit is coupled to the bandgap reference circuit, and is arranged for biasing the ring oscillator according to the bandgap reference signal. When the ring oscillator has a plurality of stages, the oscillation frequency control circuit includes one current source and a plurality of current mirrors for biasing the plurality of stages of the ring oscillator, respectively.

Oscillation control circuit for biasing ring oscillator by bandgap reference signal and related method

A bandgap reference circuit includes a first circuit, a second circuit and a third circuit. The first circuit is for generating a first current and a first voltage according to a first reference voltage. The second circuit is coupled to the first circuit, for generating a second voltage according to the first voltage. The third circuit is coupled to the first circuit and the second circuit, for generating a voltage offset according to the first current, and generating a bandgap reference voltage according to the second voltage and the voltage offset. The first circuit and the second circuit complement each other for offsetting variations of the bandgap reference voltage due to temperature changes.

Bandgap reference circuit for providing reference voltage

A semiconductor memory device includes memory cells, a sensing amplifier, a precharge circuit, and a control signal generator. The precharge circuit has a NMOS transistor and two PMOS transistors, and is used to precharge bit lines of a bit line pair, wherein the NMOS transistor is controlled by a first control signal, and the two PMOS transistors are controlled by a second control signal. The control signal generator is used to generate the first and second control signals, wherein the first control signal is at a logic high level only when the second control signal is at a first logic low level, the first control signal is at a logic low level when the second control signal is at a second logic low or a first logic high level, and the second logic low level is higher than the first logic low level.

Method for reducing standby current of semiconductor memory device

The present invention discloses a circuit for generating a dual-mode proportional to absolute temperature (PTAT) current. The circuit includes a voltage stabilizing circuit to provide a voltage reference, and a load current control circuit comprising a first transistor to provide a first load current based on the voltage reference, a second transistor to provide a second load current based on the voltage reference, a first switch to control whether to allow the first load current to flow therethrough in response to different predetermined temperatures, and a second switch to control whether to allow the second load current to flow therethrough in response to the different predetermined temperatures. A resultant current resulting from at least one of the first load current or the second load current has different current magnitudes at the different predetermined temperatures.

Circuit for generating a dual-mode PTAT current

A metal etching process is described. A substrate having a dielectric layer thereon is provided. An aluminum-copper alloy layer is formed on the dielectric layer. A hard mask layer is formed on the aluminum-copper alloy layer. A patterned photoresist layer is formed on the hard mask layer and then the hard mask layer is patterned. A thermal treatment process is performed. The thermal treatment process is carried out at a temperature of more than 300&#xb0; C. for a period of at least 3 minutes. Thereafter, the aluminum-copper alloy layer is etched using the patterned hard mask layer as an etching mask. Due to the thermal treatment, the metal precipitate (CuAl) within the aluminum-copper alloy layer is eliminated and hence the metal etching process is improved.

Metal etching process and rework method thereof

A method for forming a trench capacitor includes: removing a portion of the substrate to form a trench within the substrate; forming at a buried isolation layer within the substrate; forming in the substrate a first electrode of the trench capacitor at least in areas surrounding a lower portion of the trench; forming a dielectric layer of the trench capacitor; and forming a second electrode of the trench capacitor in the trench. The buried isolation layer intersects with the trench and has one or more gaps for providing body contact between a first substrate area above the buried isolation layer and a second substrate area below the buried isolation layer.

Trench capacitors with buried isolation layer formed by an oxidation process and methods for manufacturing the same

A semiconductor structure with partially etched gate and method of fabricating the same. A semiconductor structure with a single-sided or dual-sided partially etched gate comprises a gate dielectric layer, a gate conductive layer and a cap layer sequentially stacked on a substrate to form a gate structure, and a lining layer disposed on sidewalls of the gate structure, wherein the lining layer is partially etched to expose the adjacent gate structure. In addition, an inter-layer dielectric layer covers the gate structure and a contact is formed in the inter-layer dielectric layer, exposing the substrate and a portion of the gate structure therein, wherein the lining layer of the exposed portion of the gate structure is partially removed.

Semiconductor structure with lining layer partially etched on sidewall of the gate

A method of forming a self-aligned contact structure with a locally etched conductive layer comprises the steps of: preparing a substrate formed with gate structures comprising a first conductive layer, a second conductive layer, and an insulating layer; depositing a photoresist material layer on the substrate; performing a lithographic step with a bit-line contact node photomask or a bit-line contact photomask to expose a portion of the surface of the substrate; etching the exposed second conductive layer with an etchant; removing the remaining photoresist material layer; forming a sidewall spacer on the sidewalls of each gate structure; forming a dielectric layer to cover the substrate; and performing lithographic and etching steps to remove the dielectric layer and to form self-aligned contact structure.

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Hsinchu, Taiwan

Ming-Sheng Tung