E Ink Holdings Inc.

Prime View International Co. Ltd.

Ming-Sheng Chiang

Chi-Ming Wu

Ta-Nien Luan

Wen-Chang Lu

Chih-Cheng Wang

Yuan-Chih Tsai

Jen-Shiun Huang

Hung-Yi Tsai

Lee-Tyng Chen

Shu-Ping Yan

Jen-Yi Juang

You-Chi Tsai

Ted-Hong Shinn

Yao-Chou Tsai

Fang-An Shu

Wei-Chou Lan

Ian French

Chun-Ming Huang

Wen-Chung Tang

Shu-Hao Chang

Chen-Fa Tsai

Wan-Tien Chen

Chu-Kuang Tseng

Chen-Yuan Sung

Huai-Cheng Lin

Chen-Lung Lo

Tsung-Ting Lee

Chin-Hsuan Kuan

The invention provides a circuit substrate structure and a method for manufacturing thereof. The circuit substrate structure includes a substrate, a pixel array layer, a display unit, a peripheral circuit layer, at least one integrated circuit chip, a flexible printed circuit board, at least one flattening material layer and a passivation layer. In the circuit substrate structure, the flattening material layer is positioned on the peripheral circuit layer, and possesses at least one opening corresponded to and around the integrated circuit chip. By positioning the flattening material layer, the circuit substrate structure possesses a flat surface, and prevents producing air bubbles, so as to enhance the reliability of the display device.

Circuit substrate structure and method for manufacturing thereof

A display panel includes a display panel body, a first protective film, a second protective film, and a sealant. The display panel body has a first surface, a second surface opposite to the first surface, and a first through hole that passes through the display panel body and connects the first surface and the second surface. The first protective film is arranged on the first surface and has a second through hole connected to the first through hole. The second protective film is arranged on the second surface. The sealant fills the first through hole, so that a sidewall of the display panel body which is exposed by the first through hole is sealed, and a material of the sealant is a curable material.

Active device array substrate and display panel

A manufacturing method for a display module is provided. The method comprises following steps. A module structure comprising a cover plate, a substrate, and a front plate disposed between the cover plate and the substrate is provided. A space is defined by a lower surface of the cover plate, an upper surface of the substrate, and a side surface of the front plate. A holding structure comprising a holding layer disposed under the module structure is provided. A sealant is filled into the space. Portions of the package layer and the holding structure disposed outside a side surface of the cover plate and a side surface of the substrate are removed.

Manufacturing method for display module

A method for manufacturing an electronic ink display device is provided, which includes the steps of: forming an electronic ink layer on an driving substrate; forming a front protective layer and a back protective layer covering outside of the electronic ink layer and outside of the driving substrate separately, in which a dimension of the front protective layer is greater than that of the back protective layer; and filling an sealant covering and surrounding sidewall of the electronic ink layer and sidewall of the driving substrate. An electronic ink display device is also provided.

Electronic ink display device and method for manufacturing the same

A display device includes an active element array substrate, a display layer and a transparent shock absorption layer. The display layer is disposed on the active element array substrate. The transparent shock absorption layer is disposed on the display layer. The transparent shock absorption layer is formed by curing liquid adhesive material. A manufacturing method of display device is also provided.

Display device and manufacturing method thereof

A pixel structure includes a flexible substrate, an active device, a conductive pattern, a first insulation layer, and a pixel electrode. The active device is disposed on the flexible substrate and includes a gate, a channel, a source, and a drain. The source and the drain are connected to the channel and are separated from each other. The channel and the gate are stacked in a thickness direction. The active device is disposed between the conductive pattern and the flexible substrate. The conductive pattern is electrically connected to the drain of the active device. The first insulation layer covers the conductive pattern and has first contact holes separated from one another, and the first contact holes expose the conductive pattern. The first insulation layer is disposed between the pixel electrode and the conductive pattern. The pixel electrode is electrically connected to the conductive pattern through the first contact holes.

Pixel structure with pixel electrode connected to conductive pattern through plural contact holes

An electronic device includes a shell, a display module and a cushion. The shell includes a bottom plate and a top plate. The top plate defines an opening. The display module is disposed in the shell and faces the opening. The display module is spaced from the bottom plate of the shell. The cushion is disposed between the display module and the bottom plate of the shell, and brought into contact with the display module for cushioning the display module when an external force is applied to the display module.

Electronic device with impact-resistant display module

A manufacturing method for a flexible display apparatus is provided. A rigid substrate is provided. A flexible substrate having a supporting portion and a cutting portion surrounding the supporting portion is provided. A first adhesive material is formed between the rigid substrate and the cutting portion of the flexible substrate, so that the flexible substrate is adhered onto the rigid substrate by the first adhesive material. The first adhesive material does not locate on the supporting portion of the flexible substrate. At least a display unit is formed on the supporting portion of the flexible substrate. The supporting portion and the cutting portion of the flexible substrate are separated so as to separate the rigid substrate and the flexible substrate, wherein the flexible substrate and the display unit thereon form a flexible display apparatus. In the method, the flexible substrate and the rigid substrate can be easily separated.

Manufacturing method for flexible display apparatus

A pixel structure including a flexible substrate, an active device, a pixel electrode, a capacitance electrode, a first insulation layer, a second insulation layer, and a padding layer is provided. The pixel electrode is electrically connected to the active device and has pixel electrode openings. The capacitance electrode is disposed overlapping the pixel electrode and has capacitance electrode openings corresponding to the pixel electrode openings. The first insulation layer is disposed between the pixel electrode and the flexible substrate. The second insulation layer is disposed between the pixel electrode and the capacitance electrode. The active device is disposed between the second insulation layer and the flexible substrate. The padding layer includes padding pillars and a padding pattern covering over the active device. The padding pillars are located in the pixel electrode openings respectively. The pixel electrode partially covers the padding pattern and exposes the padding pillars.

Pixel structure

A bonding structure includes a substrate, multiple first pads, multiple second pads, an insulation layer and a patterned conductive layer. The substrate has a bonding region and a predetermined-to-be-cut region. The first pads are disposed on the substrate and within the bonding region. The second pads are disposed on the substrate and within the predetermined-to-be-cut region. The insulation layer is disposed on the substrate and covers the first and second pads. The insulation layer has multiple first and second openings respectively exposing parts of the first and second pads. The patterned conductive layer is disposed on the substrate and covers the insulation layer and the parts of the first and second pads exposed out by the first and second openings, in which the patterned conductive layer is electrically connected to the first and second pads via the first and second openings.

Bonding structure

A flexible display device includes a flexible substrate, a display layer, a first protecting layer, and at least one light-pervious polymer film. The display layer is arranged on the flexible substrate. The first protecting layer is arranged on the display layer. The at least one light-pervious polymer film is arranged on the first protecting layer. The light-pervious polymer film is used to protect the flexible display device from being damaged by external force.

Flexible display device

An electronic ink display device with a frontplane laminate and a TFT array substrate is provided. In the TFT array substrate, a first metal layer and a dielectric layer are disposed on a first substrate. The dielectric layer covers the first metal layer. A second metal layer is disposed on the dielectric layer. The first metal layer includes scan lines and gates, and the second metal layer includes data lines and sources/drains. The first substrate is divided into multiple pixel areas by the data lines and the scan lines. The gates and the sources/drains are disposed inside the pixel areas. A channel layer is disposed on the dielectric layer between the gates and the sources/drains. Pixel electrodes are disposed inside the pixel areas and connected to the drains. An electronic ink material layer of the frontplane laminate is disposed between a transparent electrode layer and the TFT array substrate.

Growing community of inventors

Hsinchu, Taiwan

Ming-Sheng Chiang