Taiwan Semiconductor Manufacturing Comp. Ltd.

Ming-Shane Lu

Fei-Gwo Tsai

Jui-Ping Chuang

Li-Kong Turn

Chung-Hao Chang

Yi-Rem Chen

Cheng-Yu Wen

Yin-Jie Wang

Hsiao-Chun Kuo

A developing method is provided. The developing method includes rotating a wafer. The developing method also includes dispensing, through a first nozzle, a developer solution onto the rotated wafer through a first nozzle at a first rotating speed. The developing method further includes dispensing, through a second nozzle, a rinse solution onto the rotated wafer through a second nozzle at a second rotating speed. The second rotating speed is less than the first rotating speed. In addition, the developing method includes simultaneously moving the first nozzle and the second nozzle during either the dispensing of the developer solution or the dispensing of the rinse solution.

Developing method

An apparatus includes an overlay mark. The overlay mark includes a first portion including a first pattern and a second portion including a second pattern. The first pattern includes a plurality of first features and a first center feature each separated by a gap along a first direction. At least two gaps are the same but are different from the other gaps, and the first centers are symmetric with respect to the first center feature. The second pattern includes a plurality of second features and a second center feature each separated by a gap along the first direction. At least two gaps are the same but are different from the other gaps, and the second features are symmetric with respect to the second center feature. The first center feature of the first pattern is aligned with the second center feature of the second pattern along a second direction.

Overlay mark and method of fabricating the same

A developing method comprises steps as follows. A wafer is rotated. A developer solution is dispensed onto the rotated wafer through a first nozzle. The first nozzle is moved back and forth between a first position and a second position, in which moving the first nozzle back and forth is performed such that the first nozzle moving forward to the second position is reversed at the second position and that the first nozzle moving forward to the first position is reversed at the first position, and the first position and the second position are directly over the wafer, and the developer solution is dispensed through the first nozzle when moving the first nozzle back and forth between the first position and the second position.

A developing method includes rotating a wafer. A developer solution is dispensed onto the rotated wafer through a first nozzle. The first nozzle is moved from a first position to a second position. The first position and the second position are over the wafer and within a perimeter of the wafer when viewed from a top of the wafer. The developer solution is dispensed through the first nozzle when moving the first nozzle from the first position to the second position. The first nozzle is moved back from the second position to the first position immediately after the first nozzle is moved from the first position to the second position. The developer solution is dispensed through the first nozzle when moving the first nozzle from the second position to the first position.

A tool and a method of developing are provided. In various embodiments, the method of developing includes rotating a wafer at a first rotating speed. The method further includes dispensing a developer solution onto the wafer at the first rotating speed by a first nozzle above the wafer, wherein the first nozzle moves back and forth along a path during dispensing the developer solution. The method further includes rotating the wafer at a second rotating speed to spread the developer solution onto the wafer uniformly. The method further includes dispensing a rinse solution onto the wafer at the second rotating speed by a second nozzle above the wafer.

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Hsinchu County, Taiwan

Ming-Shane Lu