Versitech, Inc.

The University of Hong Kong

Analog Power Intellectual Properties

Ming Liu

Xuechen Li

Yi Tsun Richard Kao

Peng Gao

Johnny Kin-On Sin

Tommy Mau-Lau Lai

Provided herein are compounds, derivatives thereof, and compositions including one or more of the compounds and derivatives, and methods for prevention and/or treatment of microbial infections and/or related diseases or conditions. The present compounds and/or derivatives thereof can be represented by Formula (I): The present methods include administering to a subject an effective amount of one or more compounds of Formula (I). In one embodiment, the microbial infections are bacterial infections. More specifically, the bacterial infections are staphylococcal infections.

Compounds and methods for the treatment of microbial infections

Provided herein are compounds, derivatives thereof, composition comprising one or more of said compounds and derivatives, and methods for prevention and/or treatment of microbial infections and/or related diseases or conditions. The present compounds and/or derivatives thereof can be represented by Formula (II): The present methods include administering to a subject an effective amount of one or more compounds of Formula (II). In one embodiment, said microbial infections are bacterial infections. More specifically, said bacterial infections are staphylococcal infections.

Compounds affecting pigment production and methods for treatment of bacterial diseases

Provided herein are compounds, derivatives thereof, composition comprising one or more of said compounds and derivatives, and methods for prevention and/or treatment of microbial infections and/or related diseases or conditions. The present compounds and/or derivatives thereof can be represented by Formula (I): The present methods include administering to a subject an effective amount of one or more compounds of Formula (I). In one embodiment, said microbial infections are bacterial infections. More specifically, said bacterial infections are staphylococcal infections.

Current practice of the common source configuration is to connect the sources of the two discrete MOSFETs (housed either in separated packages or in a single package) externally on the printed circuit board. Because the gate pads and source pads of the two dies are alternatively placed between gate and source, it does not allow the sources of the power MOSFETs to be connected internally, which requires an additional layer of circuit board to connect the sources and the gates externally. This invention provides a novel electronic device layout design and a novel packaging technique for common source configuration, placing two MOSFETs in a package with their sources connected to a single source post which is located between tow gate posts. In order to facilitate gate bonding and to prevent any shorting between gate and source, two gate pads are used and placed at the upper adjacent corners of each MOSFET.

Growing community of inventors

Hong Kong, China

Ming Liu