Asm Technology Singapore Pte Ltd

Generex Pharmaceuticals, Inc.

The Chinese University of Hong Kong

Lead Billion Limited

Asm Assembly Automation Limited

Ming Li

Yiu Ming Cheung

Lei Cheng

Dewen Tian

Hong Liu

Zhen Zhou

Kui Kam Lam

Joseph Jao Yiu Sung

Ka Yee Mak

Hui Dong

Kai Ming Yeung

Kenneth Ka Ho Lee

Ping Liang Tu

Kwok Kee Chung

Yiu Yan Wong

Ping Chung Leung

Hong-Wei Liu

Tsan Yin Peter Lo

Yick Hong Mak

Ka San Lam

Madhukumar Janardhanan Pillai

Ying Ding

Qinglong Zhang

King Ming Lo

John Elsby Sanderson

John Hon Shing Lau

Jack Chun Yiu Cheng

Edmund Cheung

Zhongyu Li

Michael Zahn

Jao Yiu Sung

Zetao Ma

Xiaoli Lin

Kai Ming Chan

Hongwei Liu

Lei The Chinese University Of Hong Kong Cheng

Edmund Ngai Man Cheung

A pharmaceutical composition and method for regenerating cardiomyocytes in treating or repairing heart muscle damages cause by an ischemic disease. The pharmaceutical composition contains an active ingredient compound with a backbone structure of Formula (I). The active ingredient compound is capable of (a) increasing viability of myogenic precursor cells to enable said precursor cells to survive through an absolute ischemic period; (b) reconstituting a damaged blood supply network in said heart region where said injured muscle is located; and (c) enhancing cardiomyogenic differentiation efficiency of said precursor cells down cardiac linage, said steps being performed simultaneously or in any particular order.

Pharmaceutical composition and method for regenerating myofibers in the treatment of muscle injuries

A method for bonding a matrix of light-emitting elements onto a substrate includes forming conductive material on bond pads of the substrate in a matrix arrangement. Separately, a plurality of light-emitting elements is also picked up and placed onto a temporary carrier in the said matrix arrangement. The temporary carrier containing the plurality of light-emitting elements is then held with a bond head, and is moved by the bond head to establish contact between electrodes on the plurality of light-emitting elements and the conductive material on the substrate. When heat is applied to the light-emitting elements while exerting a compressive force with the bond head against the conductive material, conductive joints are formed between the light-emitting elements and the substrate.

Gang bonding process for assembling a matrix of light-emitting elements

A method of bonding a die comprising solder bumps to a substrate comprising bond pads, the method comprising the steps of heating the die from a first temperature to a second temperature, wherein the first temperature is below the melting point of the solder bumps, and the second temperature is above the melting point of the solder bumps; moving the die relative to the substrate to a first height, whereat the solder bumps contact the bond pads; moving the die further away from the substrate to a second height, while maintaining contact between the solder bumps and bond pads; and thereafter cooling the die from the second temperature to a third temperature to allow the solder bumps to solidify so as to bond the die to the substrate.

Die bonding with liquid phase solder

Disclosed herein are compounds, extracts, and active fractions of the plantand methods for preventing or treating brain diseases or conditions, such as ischemic stroke, Alzheimer's disease, vascular dementia, mild cognitive impairment (MCI), chronic cerebral ischemia and Parkinson's disease. The compounds provided herein can be formulated into pharmaceutical compositions and medicaments that are useful in the disclosed methods. Also provided are the use of the compounds and extracts in preparing pharmaceutical formulations and medicaments.

Compositions and methods for the prevention and treatment of brain diseases and conditions

Disclosed herein are compounds, extracts, and active fractions of the plantand methods for increasing longevity and survival potency or for preventing or treating various medical conditions, including diabetes, inflammation, wound healing, bed sores, and ocular disorders. The compounds provided herein can be formulated into pharmaceutical compositions and medicaments that are useful in the disclosed methods. Also provided are the use of the compounds and extracts in preparing pharmaceutical formulations and medicaments.

Compositions and methods for increasing lifespan and health span

A method of feeding underfill material to fill a space between a semiconductor die and a substrate onto which the semiconductor die has been bonded, the method comprises positioning a stencil over the semiconductor die. The stencil has an elongated slot extending adjacent to an edge of the semiconductor die. Underfill material is printed through the slot such that the underfill material falls through the slot onto the substrate next to the edge of the semiconductor die. Thereafter, the underfill material is heated such that the underfill material flows across the space between the semiconductor die and the substrate from the edge of the semiconductor die to an opposite edge thereof through capillary action.

Thermally-enhanced provision of underfill to electronic devices using a stencil

A pharmaceutical composition for inhibiting mammalian red blood cell coagulation is disclosed. The composition comprises an effective amount of's organic extract and a pharmaceutically acceptable carrier.

Compositions and methods for the prevention and treatment of red blood cell coagulation

A pharmaceutical composition and method for regenerating cardiomyocytes in treating or repairing heart muscle damages or injuries caused by an ischemic disease. The pharmaceutical composition contains an active ingredient compound with a backbone structure of Formula (I). The active ingredient compound is capable of (a) increasing viability of myogenic precursor cells to enable said precursor cells to survive through an absolute ischemic period; (b) reconstituting a damaged blood supply network in said heart region where said injured muscle is located; and (c) enhancing cardiomyogenic differentiation efficiency of said precursor cells down cardiac linage, said steps being performed simultaneously or in any particular order. 

Disclosed herein are compounds, extracts, and active fractions of the plantalone or in combination withand methods for preventing or treating heart failure. The compounds provided herein can be formulated into pharmaceutical compositions and medicaments that are useful in the disclosed methods. Also provided are the use of the compounds and extracts in preparing pharmaceutical formulations and medicaments.

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A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.

Thermal compression bonding of semiconductor chips

Disclosed is a method of fabricating a light-emitting diode package, which comprises a light-emitting chip operative to emit light of a first wavelength range. The method comprises the steps of: dispensing a photoluminescent mixture on the light-emitting chip, the photoluminescent mixture being capable of absorbing a portion of light of the first wavelength range emitted from the light-emitting chip to re-emit light of a second wavelength range; partially curing the photoluminescent mixture by heating the photoluminescent mixture to a pre-curing temperature and then cooling the photoluminescent mixture to below the pre-curing temperature; and fully curing the photoluminescent mixture to harden the photoluminescent mixture. An apparatus for fabricating a light-emitting diode package is also disclosed.

Method and apparatus for fabricating a light-emitting diode package

For selecting suitable bonding parameters for forming wire bonds onto bond pads of a substrate, one or more indentations are made onto at least one bond pad of the substrate with an indentation tool by applying a series of predetermined forces onto the at least one bond pad with the indentation tool. A depth-force profile of the substrate is measured comprising a relationship between each predetermined force that is applied and a resultant depth of the indentation made by the indentation tool. An appropriate set of bonding parameters suitable for forming wire bonds on the substrate is determined based on the measured depth-force profile.

Bond pad assessment for wire bonding

A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T, which is higher than Tm, and a substrate is heated to a substrate setting temperature T, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature Tso as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards Tand solidifies.

Direct die attach utilizing heated bond head

An organic extract ofvar. (EGJ), and a pharmaceutical composition comprising the same. The organic EGJ has been identified to show potent dual effects on stimulating early growth (less than 48 hours) of new vessels both in ischemic heart muscles and in infracted heart muscles, and on triggering myocardial regeneration in myocardial infarction, and therefore, may be used in the treatment of ischemic diseases in human being or animals including ischemic heart disease and ischemic limbs, and damaged myocardium associated diseases.

An organic extract of a Chinese herbal medicinevar. has been identified that displayed potent stimulatory effects on rapid agiogenesis (&#x3c;24 h), myogenesis and blocking fibrosis in traumatized skeletal muscles. The extract has displayed potent dual effects on angiogenesis and myogenesis in damaged skeletal muscles leading to complete skeletal muscle healing in rabbit and rat animal models. The extract of the present invention can be developed into an effective therapeutic drug for the treatment of skeletal muscle trauma, soft tissue healing including burn, skin wound and operation cut, and bone fracture and defect healings.

Growing community of inventors

Hong Kong, China

Ming Li