Intel Corporation

Ming Lei

Sabina J Houle

Edward A Zarbock

A thin, deformable member may be fixed at one end, while another portion of the member rests on a hydrogel substance whose thickness changes depending on a characteristic of a liquid that permeates the hydrogel. When the hydrogel changes thickness and causes part of the member to tilt, a reflective surface on the member may reflect light in a different direction. Appropriate sensors may detect the change in the direction of the reflected light, allowing determination of the change in thickness, which in turn permits determination of the relevant characteristic of the liquid.

Hydrogel-actuated micromirrors for optical sensing

A method for attaching an integrated circuit chip to a package substrate includes placing the integrated circuit onto the package substrate, and performing reflow to attach the integrated circuit to the package substrate. The temperature of the integrated circuit and package assembly is maintained at or above a predetermined temperature prior to dispensing an underfill between the package substrate and the integrated circuit. An underfill material is dispensed between the package substrate and the integrated circuit. The underfill material is cured to a first level of curing in the integrated circuit and package assembly. The underfill material is cooled in the integrated circuit and package assembly, and the underfill material is cured to a second level of curing in which the second level of curing is greater than the first level of curing.

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Chandler, AZ, United States of America

Ming Lei