Taiwan Semiconductor Manufacturing Comp. Ltd.

Ming-Ke Tsai

Po-Hsiang Huang

Yi-Kan Cheng

Chin-Chou Liu

Fong-Yuan Chang

Chin-Her Chien

Cheng-Hung Yeh

Kai-Ming Liu

Chin-Yuan Huang

Kai-Yun Lin

Yao-Hsien Tsai

Tai-Yu Wang

A package structure and a method for forming the same are provided. The package structure includes a die, a first molding surrounding the die, a first redistribution layer (RDL), an interposer disposed over the first RDL, a second molding surrounding the interposer, a first via, and a second RDL. The first RDL includes a first dielectric layer disposed over the die and the first molding, and a first interconnect structure surrounded by the first dielectric layer and electrically connected to the die. The interposer is electrically connected to the die through the first interconnect structure. The first via extends through and within the second molding and is adjacent to the interposer. The second RDL includes a second dielectric layer disposed over the interposer and the second molding, and a second interconnect structure surrounded by the second dielectric layer and electrically connected to the via and the interposer.

Package structure and method for forming the same

Growing community of inventors

Hsinchu, Taiwan

Ming-Ke Tsai