Powerchip Semiconductor Manufacturing Corporation

Ming-Jui Tsai

Shih-Ping Lee

Yu-Chun Huo

Chih Feng Sung

Chun-Fu Wu

A wafer processing method including following steps is provided. A release layer is formed on a first wafer. An adhesive layer is formed on a second wafer. One of the first wafer and the second wafer is a device wafer. The device wafer includes a valid die region and a trimming region. A handler is applied to place the first wafer on the second wafer, so that the release layer and the adhesive layer are bonded to each other, and the adhesive layer completely covers the valid die region. During the process of placing the first wafer on the second wafer, the handler directly moves the first wafer.

Growing community of inventors

Hsinchu, Taiwan

Ming-Jui Tsai