Ams Sensors Singapore Pte. Ltd.

Ming Jie Lee

Simon Gubser

Qichuan Yu

Hartmut Rudmann

Ji Wang

Xu Yi

Bojan Tesanovic

Edmund Koon Tian Lua

Guo Xiong Wu

Eunice Ho Hui Ong

Hongyuan Liu

Myo Paing

Jian Tang

Joon Heng Tan

The present disclosure describes optical and optoelectronic assemblies that, in some cases, include screen-printed micro-spacers, as well as methods for manufacturing such assemblies and modules. For example, an optoelectronic device mounted on a substrate can include an optical sub-assembly including a first optical element and a first micro-spacer on the optical element. The optical sub-assembly can be disposed over the optoelectronic device, with a first air or vacuum gap separating the first optical element from the optoelectronic device, and the first micro-spacer laterally surrounding the first air or vacuum gap.

Optical and optoelectronic assemblies including micro-spacers, and methods of manufacturing the same

The present disclosure describes optical and optoelectronic assemblies that, in some cases, include screen-printed micro-spacers, as well as methods for manufacturing such assemblies and modules. For example, micro-spacers can be applied on a first optical element layer, and a second optical element layer can be provided on the first micro-spacers. By providing the second optical element layer on the first micro-spacers, the second optical element layer and the first optical element layer can be separated from one another by air or vacuum gaps each of which is laterally surrounded by a portion of the first micro-spacers.

The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.

Optoelectronic modules including optoelectronic device subassemblies and methods of manufacturing the same

Optoelectronic device subassemblies and methods of manufacturing the same

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Singapore, Singapore

Ming Jie Lee