Taiwan Semiconductor Manufacturing Comp. Ltd.

Ming Jie He

Yen-Yu Chen

Tung-Li Lee

Alan Chen

Hsu Chun Yuan

Yu-Wei Hsueh

Steven Li

Shuo-Jieh Wu

Hs Chiu

Provided is a method for processing a wafer that includes providing an alloy susceptor including an exterior surface and a wafer contact surface. The exterior surface of the alloy susceptor is treated to produce a roughness of the exterior surface. The roughened exterior surface of is coated with a ceramic material. The alloy susceptor including the ceramic-coated roughened exterior surface is positioned in a wafer process chamber. A plurality of layers of a film are deposited on the ceramic-coated roughened exterior surface of the alloy susceptor, wherein a first adhesion exists between the plurality of layers of the film and the ceramic material coated on the roughened exterior surface of the alloy susceptor that is greater than a second adhesion that would exist between the plurality of layers of the film and a non-roughened exterior surface of the alloy susceptor without the ceramic material.

Method of making and using alloy susceptor with improved properties for film deposition

Growing community of inventors

Jhubei, Taiwan

Ming Jie He