Avary Holding (shenzhen) Co., Limited.

Hongqisheng Precision Electronics (qinhuangdao) Co., Ltd.

Qing Ding Precision Electronics (huaian) Co., Ltd

Zhen Ding Technology Co., Ltd.

Fukui Precision Component (shenzhen) Co., Ltd.

Garuda Technology Co., Ltd.

Garlida Technology Co., Ltd.

Fukui Precison Component (shenzhen) Co., Ltd.

Ming-Jaan Ho

Fu-Yun Shen

Xian-Qin Hu

Hsiao-Ting Hsu

Man-Zhi Peng

Rui-Wu Liu

Yi-Qiang Zhuang

Biao Li

Cong Lei

Ning Hou

Shou-Jui Hsiang

Mao-Feng Hsu

Fu-Wei Zhong

Wen-Zhu Wei

Yan-Lu Li

Hao-Wen Zhong

Li-Kun Liu

Lei Zhou

Yong-Chao Wei

Szu-Hsiang Su

Cheng-yi Yang

Nan-Kun Huang

Yu-Wen Kao

Hong-yan Guo

Chia-Yin Teng

Ching-Hsuan Lin

Xin Hui Zhang

Jian Luo

Mei Yang

Lin-Jie Gao

Jun Dai

Tao-Ming Liao

Zhi-Tian Wang

Wen-Hsin Yu

Katsumi Fujiwara

Feng-Yuan Hu

Shao-Hua Wang

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber.

Heat equalization plate

A pressure sensing circuit board includes a dielectric layer, a wiring layer, a strain layer, and a protective layer. The wiring layer is on the dielectric layer. The strain layer is on the dielectric layer having the line layer. The protective layer is on the wiring layer and the strain layer. The pressure sensing circuit board includes a first copper area, a second copper area, and a copper free area. The wiring layer is located in the first copper area and the second copper area. A thickness of the line layer in the first copper area is greater than that in the second copper area, and the wiring layer in the second copper area is mesh-shaped. The strain layer is in the copper free zone and connected to the line layer. The protective layer is on the wiring layer in the second copper area and covers the strain layer.

Pressure sensing circuit board and method for manufacturing the same

An embedded circuit board, made without gas bubbles or significant internal gaps according to a manufacturing method which is provided, includes an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces and a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.

Embedded circuit board and manufacturing method thereof

A circuit board includes first circuit substrate and second circuit substrate; first circuit substrate includes: a first base layer arranged on the first circuit layer and a plurality of first conductive bodies on the substrate layer; the first circuit layer includes a hot pressing area and a non-hot pressing area except the hot pressing area. One end of the first conductive body is electrically connected to the hot pressing area and the other end is exposed to the first base layer; second circuit substrate includes: a second base layer, a second base layer arranged on the second circuit layer and a plurality of second conductive bodies; one end of the second conductive body is electrically connected to the second circuit layer, and the other end is exposed on the second base layer; The body is electrically connected to the second conductive body.

Methods of manufacturing circuit board and circuit board assembly

A covering film () includes a first covering layer (), a first adhesive layer (), and a thermal conductive layer () sandwiched between the first covering layer () and the first adhesive layer (). A thermal conductivity of the thermal conductive layer () is K1, K1 is in a range of 3 W/m.K to 65 W/m.K. A thermal conductivity of the first covering layer () is K2, K2 is in a range of 0.02 W/m.K to 3.0 W/m.K. A thermal conductivity of the first adhesive layer () is K3, K3 is in a range of 0.02 W/m.K to 1.0 W/m.K. A circuit board and its manufacturing method are also provided.

Covering film, and circuit board and manufacturing method

An embedded circuit board made without gas bubbles or significant internal gaps according to a manufacturing method which is here disclosed comprises an inner layer assembly, an embedded element, and first and second insulating elements. The inner layer assembly comprises a first main portion with opposing first and second surfaces, a first groove not extending to the second surface is positioned at the first surface. A first opening penetrates the second surface, and the first opening and the first groove are connected. The first groove carries electronic elements for embedment. The first insulating element covers the first surface and a surface of the embedded element away from the second surface. The second insulating element covers the second surface and extends into the first opening to be in contact with the embedded element.

A method for manufacturing a circuit board including: providing at least one wiring base board, the wiring base board comprising a first conductor layer, an insulation layer, and an alloy layer which are stacked in order, wherein a solder paste layer is formed on a side of the alloy layer, a part of the alloy layer is exposed out of the solder paste layer to form a thermal conductive surface; providing a core layer; and pressing two wiring base boards on two opposite sides of the core layer to form a sealed heat dissipating chamber between the thermal conductive surfaces of the two wiring base boards. The present disclosure further provides a circuit board having a heat dissipation structure.

Circuit board with heat dissipation structure and method for manufacturing same

A method for manufacturing a circuit board circuit board for transmitting high-frequency signal, including: providing a first-line circuit board (), a second circuit board (), at least one third circuit board (), a fourth circuit board (), a fifth circuit board (), and a sixth circuit board (); stacking the first circuit board (), the second circuit board (), and third circuit board () in that order, and stacking the fourth circuit board (), the sixth circuit board (), and the fifth circuit board () on the third circuit board (), and pressing them together to obtain the circuit board circuit board for transmitting high-frequency signal. The method manufacturing the circuit board circuit board for transmitting high-frequency signal can reduce a width of the transmission line. The present disclosure further provides the circuit board circuit board for transmitting high-frequency signal obtained by the above method.

Circuit board for transmitting high-frequency signal and method for manufacturing the same

A camera module includes a holder, a lens in the holder, magnets disposed on an outer wall of the holder, and a circuit board assembly. The circuit board assembly includes an outer wiring substrate, and first and second inner wiring substrates spaced out on a surface of the outer wiring substrate. The first inner wiring substrate surrounds the holder and includes a first dielectric layer and a first inner wiring layer thereon. The first inner wiring layer includes coils of wound wire in the first inner wiring layer, and each of the coils corresponds to one of the magnets. The second inner wiring substrate includes a second inner wiring layer, a thickness of each of the coils is greater than a thickness of the second inner wiring layer. A method for manufacturing the camera module is also disclosed.

Camera module and method for manufacturing the same

A method for manufacturing a circuit board () includes: providing a first single-sided circuit substrate () including an insulating base layer () and a circuit layer (); forming first conductive posts () electrically connected to the circuit layer () in the insulating base layer () to obtain a second single-sided circuit substrate (); providing a first adhesive layer (), forming second conductive posts (); providing one second single-sided circuit substrate (), defining a receiving groove () to obtain a third single-sided circuit substrate (); providing another first single-sided circuit substrate (), mounting an electronic component () on the circuit layer () to obtain a surface mounted circuit substrate (); stacking the first single-sided circuit substrate (), the first adhesive layer (), the second single-sided circuit substrate (), at least one of the third single-sided circuit substrate (), and the surface mounted circuit substrate () in that order; pressing the intermediate body ().

Circuit board with embedded electronic component and method for manufacturing the same

A method for manufacturing a circuit board comprising: providing an inner circuit substrate board comprising a first transmission area, a bendable area, and a second transmission area which are connected in an order, wherein the inner circuit substrate board further comprises a substrate layer and an inner circuit layer on the substrate layer, the inner circuit layer comprises a first signal circuit; pressing a first outer circuit substrate board on the inner circuit layer; wherein the first outer circuit substrate board comprises a first dielectric layer formed on the inner circuit layer and a first outer circuit layer formed on the first dielectric layer; the first dielectric layer is located in the first transmission area and the second transmission area; two ends of the first signal circuit are electrically connected to the first outer circuit layer.

Method for manufacturing transmission circuit board

A heat equalization plate includes a first copper clad laminate including a first copper foil, a second copper clad laminate including a second copper foil, a connecting bump, a plurality of thermally conductive bumps, and a working fluid. The second copper foil faces the first copper foil. The connecting bump is formed on a surface of the first copper foil facing the second copper foil. The thermally conductive bumps are formed on a surface of the first copper foil facing the second copper foil. The connecting bump is an annulus and surrounds the thermally conductive bumps. The connecting bump is connected to the second copper foil to form a sealed chamber. The thermally conductive bumps are received in the sealed chamber. The working fluid is received in the sealed chamber. The present invention also needs to provide a method for manufacturing the heat equalization plate.

Heat equalization plate and method for manufacturing the same

Disclosure provides an adapter board and a method for making the adapter board, which includes providing a mold in which a plurality of first fixing plates and second fixing plates are provided, providing a plurality of wires sequentially passed through the plurality of first fixing plates and the second fixing plate, injecting a non-conductive material into the cavity to form a body, and cutting the body along both sides of the first fixing plates and the second fixing plates to obtain a plurality of board bodies. The first fixing plates are provided with a plurality of first fixing holes, and the second fixing plates are provided with a plurality of second fixing holes. The board body includes a first surface and a second surface. A plurality of first connection pads are formed on the first surface, and a plurality of second connection pads are formed on the second surface.

Adapter board and method for making adapter board

A circuit board includes at least two circuit board units stacked together. Each circuit board unit includes a substrate and a circuit layer. The substrate defines a conductive hole penetrating therethrough. The conductive hole provided with a conductor therein. One side of the substrate further defines a groove, the groove including a concave portion aligned with the conductive hole. The circuit layer includes a connection pad located in the concave portion. The connection pad is shaped as a conductive protrusion, which surrounds and is electrically connected to the conductor. The circuit layer is located in the groove, and the conductive hole is electrically connecting the circuit layers of the circuit board units.

Circuit board and manufacturing method thereof

A connecting structure includes an insulation base, first pads, and second pads. The insulation base includes a first surface, a second surface, and a lateral surface connecting therebetween. First grooves are defined on the first surface, second grooves are defined on the second surface, third grooves are defined on the lateral surface. Each third groove connects one first groove and one second groove. The first pads are deposited in the first grooves. The second pads are deposited in the second grooves. Wiring portions are deposited in the third grooves, each wiring portion connects one first pad and one second pad. A conductive ink layer is coated on the first and the second pads. A protective ink layer is coated on the wiring portions and the insulating base except for the first and the second pads. The first and the second grooves are stepped grooves.

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Taipei, Taiwan

Ming-Jaan Ho