Asustek Computer Inc.

Accton Technology Corporation

Ming-Hsiu Wu

Yi-Chi Lai

Sung-Chuan Huang

Ta-Ching Kuan

Ming-Fang Tsai

Ching Ho

Ji-Hong Hsiao

Wen-Hsiung Lin

Chi-Chuan Chen

Kun-Fang Wu

Yen-Chao Huang

A fan module is provided. The fan module includes a housing and an impeller. The housing includes a cover plate. The impeller is disposed in the housing and configured to rotate around an axis. The cover plate has an outer outline away from the axis. A tangent line of an endpoint on the outer outline intersects with the axis to form an angle, and the angle is not a right angle.

Fan module and electronic device

A fan blade structure applied to a centrifugal fan is provided. The fan blade structure includes a wheel hub and an annular vane. The wheel hub includes a plurality of connecting brackets, and the annular vane includes multiple crests and troughs which interlace to form a continuous curved surface. The continuous curved surface has an outer ring surface and an inner ring surface. The connecting brackets are connected to the inner ring surface and drive the annular vane to rotate.

Fan blade structure and centrifugal fan using the same

A heat dissipating module disposed at a motherboard includes a fan, a air guiding cover, a first fin set and a second fin set. The fan provides cool air and is disposed in the air guiding cover. The air guiding cover includes a first air outlet, a second air outlet and an air guiding part connected between the first air outlet and the second air outlet. The first fin set is disposed at an upper surface of the motherboard and includes a plurality of first fins. The first air outlet covers at least a part of the first fins. The second fin set is disposed at a bottom surface opposite to the upper surface and extends to a side edge of the motherboard. The second fin set includes a plurality of second fins located beside the side edge, and the second air outlet covers the second fins.

Heat dissipating module

Fan blade

A wireless LAN antenna comprises a dielectric substrate having a first surface and a second surface. The first surface of the dielectric substrate has a rectangular loop. A rectangular grounding copper foil is adhered within the rectangular loop. A signal feeding copper foil is further included. One end of the signal feeding copper foil is connected to the rectangular loop and the grounding copper foil, while another end of the signal feeding copper foil running across another end of the rectangular loop. Moreover, a layer of back surface copper foil is plated to the back side of the printed circuit board. This back surface copper foil covers one half of the loop on the front surface. Adjustment of the transversal dimensions of the grounding copper foil will impedance-match the antenna to the feeding structure of the antenna.

Wireless LAN antenna with single loop

Growing community of inventors

Taipei, Taiwan

Ming-Hsiu Wu