Industrial Technology Research Institute

Taiwan Semiconductor Manufacturing Comp. Ltd.

Playnitride Inc.

Avision Inc.

Macroblock, Inc.

Ming-Hsien Wu

Yen-Hsiang Fang

Chia-Hsin Chao

Yao-Jun Tsai

Mu-Tao Chu

Yi-Chen Lin

Wen-Yung Yeh

Wen-Yih Liao

Jui-Ying Lin

Ying-Chien Chu

Yu-Lung Yeh

Yih-Der Guo

Shih-Hao Wang

Po-Hsun Wang

Yu-Chen Yu

Chien-Nan Tu

Li-Chun Huang

Kuo-Tung Tiao

Ming-Jer Kao

Hsi-Hsuan Yen

Chien Nan Tu

Wei-Hung Kuo

Kuang-Yu Tai

Han-Kuei Fu

Chen-Yang Huang

Chu-Li Chao

Jung-Tsung Hsu

Wei-Sheng Su

Yu-Hsiang Chang

Sheng-Chieh Tai

Ming-Hui Li

Chu-Yin Hung

Mao-Chi Lin

Chien-Chung Lin

Ching-Ching Lin

Li-Ming Sun

Kai-Ning Ku

Chia-Cheng Liu

Chia-Ling Li

Ching-Ya Yeh

Po-Yi Tseng

Chang-Chun Wu

Shen-Han Lin

Chih-Wen Huang

Feng-Pin Chang

Shih-Kung Lee

Meng-Han Lin

Stanley Chang

An optical element includes a substrate, a first insulating layer, a first optical waveguide layer, a first edge coupler, and a first micro-optical element. The first insulating layer is disposed on the substrate. The first optical waveguide layer is disposed on the first insulating layer to transmit a light beam. The first edge coupler is disposed on the first insulating layer and coupled to an end of the first optical waveguide layer. The first micro-optical element is disposed on the substrate and includes a first inclined surface. The first micro-optical element is located within a first groove formed between the substrate, the first insulating layer, the first optical waveguide layer, and the first edge coupler. The light beam is sequentially transmitted from the first optical waveguide layer to the first edge coupler, emitted from the first edge coupler, and reflected by the first inclined surface to an optical fiber connector.

Optical element

A head-mounted eye tracking system including an eye tracker, a signal processor, and a plurality of light-emitting optical guides is provided. The eye tracker is adaptable for sensing eyeballs of a wearer. The eye tracker includes a plurality of light-emitting devices and a plurality of sensing devices. The plurality of light-emitting devices are adaptable for emitting a tracking beam. The sensing devices are adaptable for receiving the tracking beam reflected by the eyeballs of the wearer. The signal processor is signally connected to the eye tracker. The plurality of light-emitting optical guides is disposed corresponding to the plurality of light-emitting devices.

Head-mounted eye tracking system

A display panel including a bottom plate, a plurality of display modules, and a plurality of connection pixel packages is provided. The display modules are tiled in an array arrangement on the bottom plate. Each of the display modules includes a circuit substrate and a plurality of display pixels. The circuit substrate includes a plurality of connection electrodes. The display pixels are disposed on the circuit substrate and at least one of the display pixels has at least one second pixel unit. Each of the connection pixel packages includes at least one first pixel unit. The connection pixel packages are disposed on the connection electrodes of the adjacent circuit substrates to connect the display modules. A light emitting surface of the at least one first pixel unit and a light emitting surface of the at least one second pixel unit are coplanar.

Display panel applied to large size or high pixel density tiling display

A light-emitting device including an epitaxial layer, a support layer, an insulating layer, a first electrode pad, and a second electrode pad is provided. The epitaxial layer includes a first type doped semiconductor layer, a light-emitting layer and a second type doped semiconductor layer, wherein the light-emitting layer is disposed on a partial area of the first type doped semiconductor layer and is between the first type doped semiconductor layer and the second type doped semiconductor layer. The support layer covers the second type doped semiconductor layer while the insulating layer covers the epitaxial layer and the support layer. The first and the second electrode pads are disposed over the insulating layer and electrically connected to the first and the second type doped semiconductor layers, respectively. The support layer extends from a first position below the first electrode pad to a second position below the second electrode pad.

Light-emitting device and display apparatus

A micro device structure including a device and a fixed structure is provided. The device has an upper surface, a lower surface, and a first side surface. The lower surface is opposite to the upper surface. The first side surface connects the upper surface and the lower surface. The fixing structure includes a connecting portion and a first turning portion. The connecting portion extends at least from the upper surface of the device to the first side surface. The first turning portion is in contact to be connected with a first end of the connecting portion and extends outward from the first side surface to be away from the first side surface. The first end of the connecting portion is located on the first side surface between the upper surface and the lower surface. A display apparatus is also provided.

Micro device structure and display apparatus

A subpixel structure includes a substrate and a light emitting diode chip. The light emitting diode chip is disposed on the substrate. The light emitting diode chip has a chip area and a light emitting area, and the light emitting area is less than or equal to one tenth of the chip area.

Subpixel structure having light shielding layer, pixel structure having light shielding layer, and light emitting diode chip light shielding layer

A method for manufacturing a display array includes the following steps: providing a substrate and forming a semiconductor stacked layer on the substrate; forming an insulating layer and a plurality of electrode pads on an outer surface of the semiconductor stacked layer, the insulating layer and the electrode pads directly contacting the semiconductor stacked layer, wherein the insulating layer has a plurality of openings spaced apart from each other; and transferring the semiconductor stacked layer, the insulating layer and the electrode pads from the substrate to a driving backplane, wherein the electrode pads are respectively electrically connected to the driving backplane through the openings of the insulating layer to form a plurality of light emitting regions in the semiconductor stacked layer as the electrode pads and the semiconductor stacked layer are energized by the driving backplane.

Method for manufacturing display array

A display array including a semiconductor stacked layer, an insulating layer, a plurality of electrode pads, and a driving backplane is provided. The semiconductor stacked layer has a plurality of light emitting regions arranged along a reference plane. The insulating layer is disposed to an outer surface of the semiconductor stacked layer and contacts the semiconductor stacked layer. The insulating layer has a plurality of openings respectively corresponding to the plurality of light emitting regions. The electrode pads are disposed to the insulating layer and are respectively electrically connect the plurality of light emitting regions through the plurality of openings. The driving backplane is disposed to the semiconductor stacked layer and electrically connected to the plurality of electrode pads, wherein a light emitting material layer of the semiconductor stacked layer has consistency along an extension direction of the reference plane.

Display array

A pixel structure includes an original light emitting diode die and a repairing light emitting diode die emitting light of a same color, and an extending conductor. The original light emitting diode die includes a first epitaxial layer, and a first electrode and a second electrode disposed at opposite sides of the first epitaxial layer. The repairing light emitting diode die includes a second epitaxial layer, and a third electrode and a fourth electrode disposed at a same side of the second epitaxial layer. The extending conductor includes a first portion, a second portion and a cut-off region. The first portion is electrically connected to the second electrode of the original light emitting diode die. The second portion is electrically connected to the third electrode of the repairing light emitting diode die. The cut-off region is located in the first portion or between the first portion and the second portion.

Pixel structure having repairing light emitting diode die and extending conductor and display having pixel structure

A spliced display including a transparent substrate, a plurality of micro (light-emitting diodes) LEDs, and a plurality of light sensors is provided. The transparent substrate has a display surface and a back surface opposite to each other. The driving backplanes are disposed on the back surface of the transparent substrate to be spliced with each other. The micro LEDs are disposed on the driving backplanes respectively and located between the micro LEDs and the transparent substrate. Each of the driving backplanes is corresponding to parts of the micro LEDs. The light sensors are disposed on the transparent substrate and located between the driving backplanes and the transparent substrate. Each of the light sensors is adjacent to at least two of the micro LEDs, and at least one of the at least two of the micro LEDs is adjacent to two of the light sensor.

Spliced display

A method for manufacturing a display array includes the following steps: providing a substrate and forming a semiconductor stacked layer on the substrate; forming an insulating layer and a plurality of electrode pads on an outer surface of the semiconductor stacked layer, the insulating layer and the electrode pads directly contacting the semiconductor stacked layer, wherein the insulating layer has a plurality of openings, and the electrode pads are respectively located in the openings of the insulating layer and separated by the insulating layer; and transferring the semiconductor stacked layer, the insulating layer and the electrode pads from the substrate to a driving backplane, wherein the electrode pads are respectively electrically connected to a portion of the semiconductor stacked layer and the driving backplane through the openings of the insulating layer to form a plurality of light emitting regions in the semiconductor stacked layer.

A pixel structure including a substrate, a first conductor, a second conductor, and a plurality of dies is provided. The first conductor is disposed on the substrate and includes a plurality of first body portions extending along a first direction, a plurality of first branch portions extending along a second direction, and a plurality of second branch portions extending along the first direction. The second conductor is disposed on the substrate and includes a plurality of second body portions extending along the second direction and a plurality of third branch portions extending along the first direction. The die includes two electrodes, wherein the first branch portions are connected between the first body portions and the second branch portions, and the two electrodes are respectively connected to the first branch portions and the second body portions or respectively connected to the second branch portions and the third branch portions.

Pixel structure

Pixel structure having repairing light emitting diode die and extending conductor, manufacturing method of pixel structure, and display having pixel structure

A spliced display including a transparent substrate, a plurality of light emitting diode modules, at least one control element and a signal transmission structure is provided. The transparent substrate has a display surface and a back surface opposite to each other. The light emitting diode modules are disposed on the back surface of the transparent substrate to be spliced with each other. Each of the light emitting diode modules includes a driving backplane and a plurality of micro light emitting diodes, and the micro LEDs are disposed in an array between the driving backplane and the transparent substrate. The control element is disposed on the transparent substrate. The control element is connected to the light emitting diode modules via the signal transmission structure, and the light emitting diode modules are connected to each other via the signal transmission structure.

Spliced display with LED modules disposed on transparent substrate

A transfer support adapted to contact a plurality of elements is provided. The transfer support has a first surface, a second surface opposite to the first surface, a recess located on the second surface, a plurality of platforms protruded from the first surface, a plurality of supporting pillars distributed in the recess and a plurality of through holes. The platforms have carry surfaces adapted to contact the plurality of elements. The through holes extend from the carry surfaces of the platforms to the recess, and two of the adjacent supporting pillars are spaced apart from each other to form an air passage. In addition, a transfer module is also provided.

Transfer support and transfer module

Growing community of inventors

Tainan, Taiwan

Ming-Hsien Wu