Innolux Corporation

Ming-Hsien Shih

Cheng-Chi Wang

Wen-Hsiang Liao

Chin-Lung Ting

Ker-Yih Kao

Kuang-Ming Fan

Yung-Feng Chen

Mei-Yen Chen

Chun-Hung Chen

Te-Hsun Lin

A semiconductor package device is provided. The semiconductor package device includes a chip and a redistribution layer disposed on the chip and electrically connected to the chip. The redistribution layer includes a plurality of first metal lines and a plurality of second metal lines, wherein at least one of the second metal lines is disposed between two adjacent first metal lines. The included angle between the at least one of the second metal lines and the two adjacent first metal lines is greater than or equal to 0 degrees and less than or equal to 10 degrees. The first width of one of the two adjacent first metal lines is greater than the second width of the at least one of the second metal lines.

Semiconductor package device having at least one second metal line between two adjacent first metal lines of redistribution layer

An electronic device including a connection element is provided. The connection element includes a first insulation layer and a second insulation layer. The first insulation layer has a first opening. A sidewall of the first insulation layer at the first opening has roughness different from roughness of a top surface of the first insulation layer. The second insulation layer is disposed on the first insulation layer, and the second insulation layer has a second opening. The sidewall of the first insulation layer at the first opening is exposed by the second opening. A method of fabricating an electronic device is also provided.

Electronic device and method of fabricating an electronic device

Growing community of inventors

Miao-Li County, Taiwan

Ming-Hsien Shih